Robert Boschgmbh

Stephan Ernst

Wolfgang Feiler

Achim Henkel

Richard Spitz

Jens Schneider

Rainer Topp

Robert Plikat

Henning Hauenstein

Jochen Seibold

Dirk Balszunat

Andreas Stratmann

Volker Brielmann

Reinhard Milich

Doerte Eimers-Klose

Stefan Hornung

Kuno Wolf

Thomas Koester

M Henning Hauenstein

Hans-Peter Jahn

Dieter Streb

Qu Ning

Jean-Marc Couffignal

Henning M Hauenstein

A heating device, which is designed as a heater for liquid fuels, has a housing component and a heating element embedded in the housing component. The heating element is designed as a self-regulating heating element, so that protection against overheating is ensured.

Heating device for liquid fuels and the like

A polarity-reversal protector for power sources, in particular for automobile batteries, which is connected between a power source and at least one consumer and/or at least one generator, is described. The polarity-reversal protector is to prevent the reverse polarity current from flowing through the connected systems, so that the systems may not be damaged in case of polarity reversal. For this purpose, the polarity-reversal protector includes means for recognizing whether the two poles of the power source are connected to the appropriate terminals of the consumer and/or generator, and means for decoupling the power source from the consumer and/or from the generator if the two poles of the power source have been transposed during connection to the consumer and/or generator.

Polarity-reversal protection circuit for energy sources

A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by metal strip conductors, the semiconductor component and the punched grid are joined so that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends is then possible, this mechanical mounting at the same time establishing an electric connection between the electric terminals of the semiconductor component and the internal terminal ends, whereby a metal strip grid, e.g., a punched grid, which, even before being joined to the semiconductor component, has already been embedded on at least one side in at least one partial area in a material that is not electrically conductive, is used as the metal strip grid. This procedure is used for bond-free contacting of semiconductor components for high-power applications in which a power loss of more than 1 Watt may occur.

Method for electrically connecting a semiconductor component to an electrical subassembly

A method for packaging electronic assemblies and a multiple chip package, at least one power semiconductor chip being applied to a base plate using a first solder, at least one logic chip being applied to the base plate, the logic chip and the base plate being positioned electrically insulated from one another, at least one logic chip being connected to the at least one power semiconductor chip using signal transmission lines, and the electronic assembly including the at least one power semiconductor chip and the at least one logic chip being packaged using a molding compound in order to provide a multiple chip package.

Method for packaging electronic modules and multiple chip packaging

A device, an ammeter and a motor vehicle, having a first section and a second section of a conductor for the purpose of measuring the electrical amperage in the conductor are described; a first sensor means and a second sensor means being provided; the current flowing in the first section and in the second section generating a useful magnetic field; the first sensor means being provided to measure the useful magnetic field; the second sensor means being provided in a location where the useful magnetic field disappears; the second sensor means being provided to measure a magnetic interference field; and the measurement of the useful magnetic field being correctable by the measurement of the magnetic interference field.

Device, ammeter and motor vehicle

A method is described for producing electric modules, where a power module is attached to a fastening part with an adhesive, with the adhesive first being precured in an edge area, and in another step the power module is encased in a gel. In another step, the gel and the adhesive are fully cured together in one step. This method is cost- and time-optimized for producing a compact electric module with power modules that have a high power loss and are exposed to high mechanical stresses.

Method for manufacturing electric modules, and the electric module

Growing community of inventors

Ostfildern, Germany

Stephan Ernst