Infineon Technologies Ag

Qimonda Ag

First Sensor Ag

Stephan Dobritz

Harry Hedler

Roland Irsigler

André Hanke

Thorsten Meyer

Knut Kahlisch

Stefan Ruckmich

Martin Wilke

Henning Mieth

Kimyung Yoon

Christoph Polaczyk

Steffen Kröhnert

Sabine Friedrich

An arrangement for an optoelectronic component includes a substrate and an optical semiconductor chip arranged on the substrate. The optical semiconductor chip has an optically active region, a first optically non-active region, and a second optically non-active region. A connection structure connects a chip-side electrical connection to the optically active region. An electrical connection connects the chip-side electrical connection to a second substrate-side electrical connection. A coating is provided in a layer stack in the optically active region, in the first optically non-active region, and in the second optically non-active region. The layer stack includes a first layer and a second layer arranged above the first layer. The chip-side electrical connection and the connection structure in the first optically non-active region and the protective layer in the second optically non-active region are each arranged between the first layer and the second layer.

Arrangement for an optoelectronic component, manufacturing process and optoelectronic component

According to one embodiment of the present invention, a semiconductor device is provided, that includes a semiconductor carrier; a cavity formed within the semiconductor carrier, the cavity extending from the top surface of the semiconductor carrier into the semiconductor carrier; and at least one semiconductor chip provided within the cavity.

Semiconductor device

An integrated circuit, a circuit system and method of manufacturing such is disclosed. One embodiment provides a circuit chip including a first contact field on a chip surface; and an insulating layer on the chip surface. The insulating layer includes a flexible material. A contact pillar is coupled to the first contact field and extends from the chip surface through the insulating layer. The contact pillar includes a conductive material.

Integrated circuit, circuit system, and method of manufacturing

A method for manufacturing a wafer level package of an integrated circuit element for direct attachment to a wiring board is disclosed. An integrated circuit element includes input/output pads located on an active side. A non-conductive support structure is formed on the active side of the integrated circuit element in an area that is free from input/output pads. A conductive path is formed upon the support structure and a non-conductive coating is formed on over the active side of the integrated circuit element such that a surface is formed which leaves interface pads accessible.

Method for manufacturing a wafer level package

According to one embodiment of the present invention, an electric device includes: a top surface and a bottom surface; a contact hole extending from the top surface through the device to the bottom surface; a conductive sealing element which seals the contact hole at or near the bottom surface; a conductive connection which is coupled to the conductive sealing element and which extends through the contact hole to the top surface; and solder material which is provided on a bottom surface of the conductive sealing element.

Electric device, stack of electric devices, and method of manufacturing a stack of electric devices

The present invention relates to an integrated device comprising an electronic circuit chip, a solder contact structure to provide contact to the electronic circuit chip and an elastic contact structure to provide contact to the electronic circuit chip, wherein the solder contact structure and the elastic contact structure are arranged on a contacting surface of the integrated device.

Integrated device and electronic system

An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip. A plurality of connection elements are positioned for electrical contact-connection with a printed circuit board. The interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate.

Interconnection element for BGA housings and method for producing the same

An arrangement for producing an electrical connection between a ball grid array (BGA) package and a signal source is disclosed. A flexible printed circuit board (PCB) has conductor (e.g., copper) tracks arranged between flexible plastic layers. A contact receptacle with guide elements for the BGA package is located over a portion of the flexible PCB. Contact structures are electrically coupled to the conductor tracks of the flexible PCB and accessible via the contact receptacle. The contact structures serve for providing an electrical contact-connection of terminals of a BGA package placed in the receptacle. The contact structures comprise column- or sleeve-shaped contact elements that extend through the flexible PCB and project upwards on one side from one of the flexible plastic layers.

Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection

A leadframe of a conductive material includes a central region to accommodate a chip and a plurality of connecting fingers extending at least from one side in the direction of the central region, a contact region being provided adjacent to the central region on at least some of the connecting fingers. The course of the connecting fingers is such that a sectional face in an arbitrary imaginary cross-section at right angles to the main face of the leadframe has leadframe material. In such a case, it is attempted to keep cross-sections in a component without leadframe material as small as possible.

Growing community of inventors

Dresden, Germany

Stephan Dobritz