Sensirion Ag

Invensense, Inc.

Sensirion Automotive Solutions Ag

Stephan Braun

Werner Hunziker

Chung-Hsien Lin

Felix Mayer

Markus Graf

Ulrich Bartsch

Rene Hummel

Marc Von Waldkirch

René Hummel

Tobias Schmid

David Pustan

Matthias Merz

Johannes Buhler

Ralph Steiner Vanha

Marion Hermersdorf

Johannes Bühler

Lukas Hoppenau

Manuel Becker

Lukas Winkler

Thomas Brugger

Markus Wiget

Matthias Boeller

Matthias Böller

A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (), wherein the at least one sensor () is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.

Sensor module for air quality measurement

An electronic component comprises a carrier (), a sensor device () mounted on the carrier (), which sensor device () comprises a sensor chip (), and an electrostatic discharge protection element () for protecting the sensor chip () from an electrostatic discharge, which protection element () is mounted on the carrier ().

Electronic component including sensor device and method of manufacturing same

A sensor package comprises a sensor chip () with a sensitive element () exposed to an environment of the sensor package, and contact pads () for electrically contacting the sensor package. Electrical connections () are applied between the sensor chip () and the contact pads (). A molding compound () at least partially encloses the sensor chip () and the contact pads (). A unit () consisting of the sensor chip () and optionally of a die pad () supporting the sensor chip () is arranged such that a top surface (ts) of the unit () does not protrude from a level defined by a top surface (ts) of the contact pads (), and a bottom surface (bs) of the unit () does not protrude from a level defined by a bottom surface (bs) of the contact pads ().

Sensor package

A sensor device comprises a sensitive element () and a support () for the sensitive element, the support having a surface () with an access opening () to the sensitive element (). A layer of adhesive material () covers at least parts of the surface (). A venting medium () extends over the entire surface () of the support () and the access opening () and is attached to the support () by the layer of adhesive material ().

Sensor device

A pressure sensor comprises a first substrate containing a processing circuit integrated thereon and a cap attached to the first substrate. The cap includes a container, a holder, and one or more suspension elements for suspending the container from the holder. The container includes a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. The container is suspended from the holder such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit.

Reduced stress pressure sensor

Growing community of inventors

Stafa, Switzerland

Stephan Braun