Cemecon Ag

Stephan Bolz

Oliver Lemmer

Werner Kölker

Lars Hultman

Antonius Leyendecker

Walter May

Grzegorz Greczynski

Werner Koelker

Jürgen Balzereit

Ivan Petrov

Joseph Greene

The invention relates to a coating method and to a coating device for coating a body. A magnetron cathode having a target is arranged in the vacuum chamber. Electrical power is supplied to the magnetron cathode such that a plasma is generated and the target is sputtered in order to deposit a coating on the body. The electrical power is periodically supplied within a period duration T according to the HIPIMS method as cathode pulses, wherein each cathode pulse comprises at least two cathode sub-pulses and an intervening cathode sub-pulse break. In order to be able to deposit coatings having favorable properties in a particularly favorable manner by using the chopped HIPIMS method, a bias voltage is applied to the substrate to be coated with bias voltage pulses, wherein each bias voltage pulse comprises at least two bias sub-pulses and an intervening bias sub-pulse break.

Coating apparatus and coating method having divided pulses

The invention relates to a method for coating a substrate, a coating system for carrying out the method, and a coated body. In a first method step, the substrateis pretreated in a ion etching process. In a second method step, a first coating layerwith a thickness of 0.1 μm to 6 μm is deposited on the substrateby means of a PVD process. In order to achieve a particularly high-quality and durable coating, the surface of the first coating layeris treated by means of an ion etching process in a third method step, and an additional coating layerwith a thickness of 0.1 μm to 6 μm is deposited on the first coating layerby means of a PVD process in a fourth method step. The coated body comprises at least two coating layerswith a thickness of 0.1 μm to 6 μm on a substrate, wherein an interface region formed by ion etching is arranged between the coating layers

Multi-layer coating

The invention relates to a sputtering target, a coating system, and a coating method for same. The sputtering target comprises a base plate with a target plate which is secured thereon and which is made of a first sputtering material with a surface and a plurality of recesses formed therein. A plurality of inserts are arranged in the recesses. At least some of the inserts are made of a second sputtering material, wherein the second sputtering material has a higher sputter yield than the first sputtering material. The aim of the invention is to achieve especially uniform coatings. This is achieved in that the inserts made of the second sputtering material are shaped such that the extent D1, D2 of the inserts, measured in a measuring direction parallel to the surface, increases from the surface to the base plate in a depth direction T.

Sputtering target

The invention relates to a coated body and to a method for coating a body. The coated body comprises at least a substrate (), a diamond layer () having a thickness of 1-40 &#x3bc;m, and a hard material layer (), which is arranged farther outside on the body () than the diamond layer (). The hard material layer () comprises at least one metal element and at least one non-metal element. An adhesive layer () having a thickness of 2-80 nm is provided between the diamond layer () and the hard material layer (). The adhesive layer () contains carbon and at least one metal element. The diamond layer () can be applied by means of a CVD method. The hard material layer can be applied by means of a PVD method. The adhesive layer () between the diamond layer () and the hard material layer () can be produced in that, before the hard material layer () is applied, the surface of the diamond layer () is pretreated by means of HIPIMS metal ion etching, wherein ions are implanted into or diffuse into the surface of the diamond layer () by means of metal ion etching.

Coating a body with a diamond layer and a hard material layer

A process and a device for coating a substrate () are described. In a vacuum chamber (), a first magnetron cathode () is provided with a sputtering target () of a first metal composition comprising predominantly aluminium. A second magnetron cathode () is provided with a sputtering target () of a second metal composition comprising at least 50 at-% of a second metal selected from groups IVA-VIA of the periodic table. In order to obtain coatings with improved properties, electrical power is supplied to the cathodes () such that the targets () are sputtered, where electrical power is supplied to the first cathode () as pulsed electrical power according to high power impulse magnetron sputtering with a first peak current density, and to the second cathode () with a second peak current density lower than the first peak current density. The substrate () is arranged within the vacuum chamber such that particles from the plasma deposit onto the substrate forming a coating.

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Aachen, Germany

Stephan Bolz