Cree Gmbh

Kyocera Sld Laser, Inc.

Ideal Industries Lighting LLC

University of California

The United States of America As Represented by the Department of Energy

Soraa Laser Diode, Inc.

Sten Heikman

James Ibbetson

Eric Goutain

James W Raring

Bernd P Keller

Eric J Tarsa

Yifeng Wu

Jesse Colin Reiherzer

Theodore D Lowes

Hormoz Benjamin

John Adam Edmond

Paul Rudy

Melvin McLaurin

Primit A Parikh

Troy Trottier

James Harrison

Michael Cantore

Matthew Donofrio

Yuvaraj Dora

John K Roberts

Christopher P Hussell

Robert D Underwood

Zhimin Jamie Yao

Ronald W Bessems

Fan Zhang

Cole J Cunnien

Matthew Jacob-Mitos

Umesh Kumar Mishra

Michael John Bergmann

Scott Thomas Sheppard

Kevin Haberern

George R Brandes

Likun Shen

Ting Li

Marcia Moore

Kevin Shawne Schneider

Julio Garceran

Oscar Romero

Harshad Golakia

Pritish Kar

R Peter Smith

Terry Towe

Sudeep Khanal

Naji Barakat

Raymond Ong

Rajeev Acharya

A laser-based light source includes a material arranged on a package base adjacent to a laser diode chip and an optical element coupled to the material. The optical element is aligned to receive electromagnetic radiation from the laser diode chip. The optical element includes a wavelength conversion material and is configured to receive at least a portion of the electromagnetic radiation emitted by the laser diode chip. A reflective material surrounds sides of the optical element.

Laser-based integrated light source

A phosphor integrated laser-based light source includes a thermally conductive material arranged on a package base adjacent to a laser diode chip and an optically transparent material coupled to the thermally conductive material. A groove extends between the thermally conductive material and the optically transport material and is aligned to receive electromagnetic radiation from the laser diode chip. A wavelength conversion material is coupled to the optically transparent material and is configured to receive at least a portion of the electromagnetic radiation emitted into the groove and transmitted through the optically transparent material. A reflective material surrounds sides of the optically transparent material and the wavelength conversion material.

Laser-phosphor integrated light source

The present techniques include a plurality of laser lamp modules. In an example, the plurality of laser lamp modules includes a high beam wide lamp module, a high beam narrow lamp module, a low beam cut lamp module, and a low beam wide lamp module, each of which has a blue laser, and is sealed from an outside environment for reliability.

Laser high beam and low beam headlamp apparatus

The embodiments described herein provide a high-luminous flux laser-based white light source. A plurality of laser packages are arranged in an array pattern on a common support member. The plurality of laser packages each include one or more laser diode devices and a phosphor member. The phosphor member converts a fraction of the electromagnetic radiation from each of the laser diode devices to an emitted electromagnetic radiation and a white light is outputted.

High-luminous flux laser-based white light source

A laser-based fiber-coupled wide-spectrum light system is provided. The system includes a laser device and one or more phosphor members configured and arranged to provide wide-spectrum emissions. One or more fibers are configured and arranged to receive the wide-spectrum emissions.

Laser-based light guide-coupled wide-spectrum light system

The embodiments described herein provide a device and method for an integrated white colored electromagnetic radiation source using a combination of laser diode excitation sources based on gallium and nitrogen containing materials and light emitting source based on phosphor materials. A violet, blue, or other wavelength laser diode source based on gallium and nitrogen materials may be closely integrated with phosphor materials, such as yellow phosphors, to form a compact, high-brightness, and highly-efficient, white light source. The phosphor material is provided with a plurality of scattering centers scribed on an excitation surface or inside bulk of a plate to scatter electromagnetic radiation of a laser beam from the excitation source incident on the excitation surface to enhance generation and quality of an emitted light from the phosphor material for outputting a white light emission either in reflection mode or transmission mode.

Integrated white light source using a laser diode and a phosphor in a surface mount device package

Laser high beam and low beam headlamp apparatus and method

A method includes the steps of obtaining a frame from an image sensor, the frame comprising a number of pixel values, detecting a change in a first subset of the pixel values, detecting a change in the second subset of the pixel values near the first subset of the pixel values, and determining an occupancy state based on a relationship between the change in the first subset of the pixel values and the second subset of the pixel values. The occupancy state may be determined to be occupied when the change in the first subset of the pixel values is in a first direction and the change in the second subset of the pixel values is in a second direction opposite the first direction.

Image analysis techniques

Simplified LED chip architectures or chip builds are disclosed that can result in simpler manufacturing processes using fewer steps. The LED structure can have fewer layers than conventional LED chips with the layers arranged in different ways for efficient fabrication and operation. The LED chips can comprise an active LED structure. A dielectric reflective layer is included adjacent to one of the oppositely doped layers. A metal reflective layer is on the dielectric reflective layer, wherein the dielectric and metal reflective layers extend beyond the edge of said active region. By extending the dielectric layer, the LED chips can emit with more efficiency by reflecting more LED light to emit in the desired direction. By extending the metal reflective layer beyond the edge of the active region, the metal reflective layer can serve as a current spreading layer and barrier, in addition to reflecting LED light to emit in the desired direction. The LED chips can also comprise self-aligned and self-limiting features that simplify etching processes during fabrication.

High efficiency LEDs and methods of manufacturing

This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

Chip with integrated phosphor

LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility in using the packages in different applications.

LED package with encapsulant having planar surfaces

LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with a plurality of LEDs, which emit different colors of light, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material to be absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. The LED package can have a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package provides unique dimensional relationships between the features and LED package ratios, enabling more flexibility with different applications.

LED package with multiple element light source and encapsulant having planar surfaces

Growing community of inventors

Goleta, CA, United States of America

Sten Heikman