The Boeing Company

Stella Fors

Andrew Paul Nowak

Ashley M Dustin

Carissa Ann Pajel

Phuong Bui

Melinda Dae Miller

Xin Ning Guan

Shahriar Alam

Michael Jared Ventuleth

An adhesion promoter composition is disclosed. The adhesion promoter composition also includes one or more reactive silanes which includes a mercaptopropyltrimethoxysilane, a glycidoxypropyltrimethoxysilane, or combinations thereof. The adhesion promoter composition also includes one or more reactive organometallics. The composition may include one or more organic solvents, an optional one or more gelling agents, and an optional one or more functional additives. A method for applying the adhesion promoter composition is disclosed, including contacting the one or more organic solvents, the one or more reactive silanes, the one or more reactive organometallics, the optional one or more gelling agents, and the one or more functional additives with one another to prepare the adhesion promoter composition, homogenizing the adhesion promoter composition, applying the adhesion promoter composition to a substrate, evaporating the organic solvents from the adhesion promoter composition, and applying a resin or paint layer over the adhesion promoter composition.

Adhesion promoter compositions to eliminate substrate preparation and methods for the same

Resistive inks and method of making resistive inks that utilize a phthalonitrile resin as a curable component in the inks are disclosed. In one example, a resistive ink is provided. The resistive ink comprises a solvent, a thermally-curable phthalonitrile-based resin dissolved in the solvent, and one or more conductive fillers. In some examples, the phthalonitrile resin can comprise a B-staged material.

Phthalonitrile-based high temperature resistive inks

A cure promoter composition is disclosed, including an accelerator which may include a thiocarbamate, a hydrated thiocarbamate, a dithiocarbamate, a thiazole, a mercaptothiazole, a sulfenamide, a thiazolesulfenamide, a metal salt of thiocarbamate, sulfur chloride, or combinations thereof. The cure promoter composition also includes a compatibilizing carrier, one or more organic solvents, a catalyst, an optional reducing agent, an optional reactive silane, an optional reactive organometallic, an optional gelling agent, and an optional aqueous component. A method for applying the cure promoter composition is disclosed, including contacting the organic solvents, the accelerator, the carrier, the reactive silanes, the reactive organometallics, the reducing agents, and the catalyst with one another to prepare the cure promoter composition, homogenizing the cure promoter composition, pausing after homogenizing to allow the cure promoter time to react, applying a sealant onto a substrate, and applying the cure promoter composition to a surface of the sealant.

Cure promoter compositions and methods for the same

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Los Angeles, CA, United States of America

Stella Fors