Infineon Technologies Ag

Steffen Schumann

Gunther Lehmann

Frederic Gueganton

Gurushiddappa Naduvinamane

Prashant Chaudhry

Gernot Langguth

Adrien Benoit Ille

In accordance with an embodiment, a memory cell device includes at least one memory cell; a first switch connected between the at least one memory cell and a reference potential node; a second switch connected between the at least one memory cell and the reference potential node, and switch driver logic adapted to put the first switch selectively into one of at least three operating states by activation or deactivation of a first subcircuit of the switch driver logic, wherein the at least three operating states comprises an on state, an off state, and a conductive state in which an electrical conductivity of the first switch is lower than in the on state and higher than in the off state, and put the second switch selectively into one of the at least three operating states by activation or deactivation of a second subcircuit of the switch driver logic.

Memory cell device and method for operating a memory cell device

In accordance with an embodiment, a method for electrostatic discharge (ESD) protection includes: dividing a voltage between a plurality of circuit nodes using a voltage divider circuit to form a divided voltage; compensating a temperature dependency of the divided voltage to form a temperature compensated divided voltage; monitoring the voltage between the plurality of circuit nodes using a transient detection circuit to form a transient detection signal; and activating a clamp circuit coupled between the plurality of circuit nodes based on the temperature compensated divided voltage and based on the transient detection signal.

System and method for temperature compensated ESD protection

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Munich, Germany

Steffen Schumann