Robert Boschgmbh

Steffen Schmidt

Christoph Treutler

Horst Muenzel

Werner Herden

Heribert Weber

Kurt Weiblen

Klaus Heyers

Matthias Kuesell

Andreas Lock

Franz Laermer

Jiri Marek

Wolfgang E Mueller

Roland Mueller-Fiedler

Helmut Baumann

Hans-Peter Trah

Herbert Goebel

Frank Bantien

Eckart Reihlen

Werner Steiner

Uwe Lipphardt

Manfred Moellendorf

Hans-Friedemann Kober

Detlef Gruen

Michael Gundlach

Joerg Buth

Franz Riedinger

Christoph Kampshoff

Rolf Benz

A process for producing a sensor membrane substrate, in particular, for a mass flow sensor or a pressure sensor, the substrate having on its front a membrane, which is fixed at the edge of an opening that is etched free from the back. The process includes the following steps: providing a substrate; local thickening the substrate in an area on the front opposite the edge, the thickened portion having a continuous transition to the substrate; depositing a membrane layer on the front having the locally oxidized area; and etching free the opening from the back to clear the membrane in such a way that the edge is located underneath the thickened area.

Process for producing a sensor membrane substrate

With a sensor and method, it is possible for platinum resistor elements to be used advantageously as heating elements, temperature sensors, printed circuit traces, or as chemically resistant electron beam sensitive layers. To ensure a long-lasting adhesion of the platinum resistance layer to a dielectric substrate, even during exposure to temperatures which are elevated over ambient temperature and under dry and most atmospheric conditions, a thin adhesion layer of platinum silicide, for example, is deposited between the platinum resistance layer and the dielectric substrate. Resistor elements patterned from the platinum layer can advantageously be used in temperature sensors, mass flow sensors, chemical sensors, gas sensors, or humidity sensors.

Sensor and method for manufacturing a sensor

A sensor has a membrane, on which at least one resistor element is situated. The membrane has a membrane layer which is composed of a plurality of partial layers. In addition, a covering layer is provided which is composed of a plurality of partial layers. The partial layers of the membrane and the covering layer are selected so that both in the membrane and in the covering layer light tensile stresses are set, the tensile stresses preferably being roughly the same.

Sensor having a membrane

In a mass flow sensor having a frame of monocrystalline silicon and a membrane fixed therein, a heating element and, if indicated, temperature-measuring elements are provided on the membrane. A heat-conducting element, which extends from the membrane across the frame, is provided in the edge area of the membrane. The heating element, the heat-conducting element and, if indicated, temperature-measuring elements are patterned out of a single metal layer.

Mass flow sensor

In a measuring element for a flow sensor and a method for manufacturing the measuring element, a heater, a temperature sensor, and a printed circuit trace are patterned out of a platinum layer. Furthermore, an interconnection region is used for contacting the measuring chip with bonding wires. An additional metal layer is provided for the interconnection region.

Measuring element for a flow sensor

Silicon chip for use in a force-detection sensor

In a pressure sensor, a force is transferred via a pressure plunger end made of relatively hard material onto a measurement element including a sensor membrane on a support. The sensor membrane is part of a micromechanical arrangement made of silicon. A metal structure made of a metal of lower hardness compared with the hardness of the material of the pressure plunger end is applied onto the sensor membrane. This metal structure can be impressed and plastically deformed with increased force by the contact surface of the pressure plunger end, in such a way that conforming contact of the contact surface is achieved, and potential angular errors are compensated for.

Pressure sensor

A method of making micromechanical structures from silicon involves cutting a monocrystalline silicon wafer. The orientation of the crystal structure relative to the flat of the wafer is first determined, and this information is taken into account in the subsequent structuring steps.

Method of making micromechanical components

An electronic component with at least one silicon chip is proposed, where the silicon chip is provided with electronic switching elements on at least one main surface. The silicon chip is bonded to a glass support with its main surface provided with the electronic switching elements and forms a unit together with it, which is applied to a housing having connector pins for the electrical contact with the silicon chip. The glass support has through-bores in the same modular pattern as the connector pins of the housing, into which the connector pins extend. The through-bores in the glass support are filled with conductive paste, so that the electrical contact between the silicon chip and the connector pins is provided by the conductive paste.

Method for manufacturing a semiconductor package including a glass

Growing community of inventors

Reutlingen, Germany

Steffen Schmidt