Infineon Technologies Ag

Robert Boschgmbh

Steffen Orso

Alexander Heinrich

Manfred Mengel

Edmund Riedl

Evelyn Napetschnig

Boris Adam

Thomas Behrens

Oliver Eichinger

Lim Fong

Juergen Jerg

Erik Sueske

Dietmar Schaible

Tuncay Sentuerk

Tatiana Barsukova

Uta Kienzle

Jamel-Eddine Turki

Manuela Keil

Alexander Baer

A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer.

Chip arrangements

A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

Solder alloys and arrangements

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Reutlingen, Germany

Steffen Orso