Firma Carl Freudenberg

Other

Carl Freudenberg Kg

Steffen Kosack

Jorg Hausdorf

Horst Kober

Werner Schafer

Volker Siekermann

Rolf Schneider

Thomas Kuhlmann

Bardo Anselm

Thomas Klenk

G&uuml;nter Hofmann

Stefan Seiderer

Karl-Heinz Spiess

Ulrich Liedtke

Peter Schafer

Andreas Hartmann

Frank Schultz

Klaus-J&uuml;rgen Peschges

A flat gasket made up of at least one layer of nonwoven fabric consisting of a sheet of asbestos-free fibers or fiber mixtures and impregnated with a polymer, the sealing element consisting of at least one polytetrafluoroethylene-impregnated nonwoven fabric.

Flat packing and method for the production thereof

A method of applying surface-modifying auxiliary substances to the working area interior surfaces of die molds for the production of molded products, in particular made of rubber or plastics. The auxiliary substance is supplied in the form of a gas or vapor to the interior surfaces of the die mold, which is integrated into the processing machine, and the gas or vapor is condensed there.

Method and device for applying surface-modifying auxiliary substances to working area interior surfaces of die molds

A flat seal having a first and a second sealing surface made of polymer material is disclosed. Each of the polymer sealing surfaces is made of a formed-fabric-reinforced cover layer. At least two of these cover layers together provide a flexible, electrical printed-circuit board, whose material completely surrounds electrical interconnect traces in the sealing areas. The interconnect traces are provided with connecting conductors, which are brought with terminal pads out of the printed-circuit board. The material of the cover layers has an electrical resistance of at least 10.sup.8 ohm and provides insulation for the interconnect traces.

Flat seal

A thermostable substrate for flexible circuit boards having excellent flame-resistance, handling, and storage qualities may be produced by treating a substrate of a nonwoven fabric or paper with a flame-resistant, halogen-free polymeric composition. The polymeric composition comprises an aqueous mixture of a copolymerizate of acrylic acid esters and styrene, and an aminoplastic or phenoplastic precondensate to which a mixture of fine-particle red phosphorus and fine-particle ammonium polyphosphate is also added.

Flame-resistant substrate for flexible circuit boards

Polyurethane can be reclaimed from solvent-containing or solvent-free polyurethane wastage by adjusting the amount of solvent, preferably with methyl ethyl ketone; adding an emulsifier, preferably, acylpolyethyleneglycolester; then adding about twelve times the wastage weight of water; mixing, preferably for about one hour at room temperature to form an emulsion; and then expelling the solvent as a two-phase distillate using steam; separating solvent from the resulting two-phase distillate; filtering off polyurethane granular material left floating in the water residue, and drying the separated granular material.

Process for recovering polyurethane from polyurethane waste pastes

A flame-resistant cover film for flexible circuit boards having excellent flame-resistance, handling, and storage qualities may be produced by treating an insulating film of a nonwoven polymer fabric with a flame-resistant, halogen-free polymeric adhesive. The polymeric adhesive comprises an aqueous mixture of a copolymerizate of acrylic acid esters and styrene, and an aminoplastic or phenoplastic precondensate to which a mixture of fine-particle red phosphorus and fine-particle ammonium polyphosphate is also added.

Flame-resistant cover film for flexible circuit boards

Reuseable polyvinyl chloride is recovered from solvent-loaded waste polyvinyl chloride paste by adding one twentieth of the paste weight of an acyl polyethylene glycol ester, then adding about twice the paste weight of water, while stirring, driving off the solvent by steam distillation, separating the solvent from the resulting two-phase distillate, and filtering off and drying the polyvinyl chloride granules floating in water left behind in the distillation residue.

Growing community of inventors

Hassloch, Germany

Steffen Kosack