Telefonaktiebolaget Lm Ericsson (publ)

Stefano Tirelli

Marco Romagnoli

Alessandra Bigongiari

Gabriele De Angelis

A photonic chip is disclosed that comprises a cladding material and an edge coupler. The edge coupler comprises a composite guiding structure that comprises a plurality of substantially parallel planar layers of optical guiding material. Each layer of the composite guiding structure extends into the cladding material, wherein each layer is aligned at a first edge of the photonic chip. The layers overlap along a first axis which is perpendicular to a plane of the planar layers of optical guiding material. The photonic chip is arranged for deposition of a waveguide on the cladding material, the waveguide being arranged to at least partially overlap along the first axis with a layer of the composite guiding structure. Also disclosed is a method of manufacturing a photonic chip.

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Pisa, Italy

Stefano Tirelli