Stmicroelectronics S.r.l.

Stmicroelectronics Ltd (malta)

Stefano Pozzi

Simone Sassolini

Ilaria Gelmi

Conrad Cachia

Mark Anthony Azzopardi

Massimo Garavaglia

A method for testing a strip of MEMS devices, the MEMS devices including at least a respective die of semiconductor material coupled to an internal surface of a common substrate and covered by a protection material; the method envisages: detecting electrical values generated by the MEMS devices in response to at least a testing stimulus; and, before the step of detecting, at least partially separating contiguous MEMS devices in the strip. The step of separating includes defining a separation trench between the contiguous MEMS devices, the separation trench extending through the whole thickness of the protection material and through a surface portion of the substrate, starting from the internal surface of the substrate.

Method for strip testing of MEMS devices, testing strip of MEMS devices and MEMS device thereof

A method for manipulating MEMS devices integrated on a semiconductor wafer and intended to be diced one from the other includes bonding of the semiconductor wafer including the MEMS devices on a support with interposition of a bonding sheet. The method may also include completely cutting or dicing of the semiconductor wafer into a plurality of independent MEMS devices, and processing the MEMS devices diced and bonded on the support in a treatment environment for semiconductor wafers. A support for manipulating MEMS devices is also included.

Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support

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Milan, Italy

Stefano Pozzi