Nokia Solutions and Networks Oy

Nokia Technologies Oy

Accelsius, LLC

Stefano Grillanda

Raffaele Luca Amalfi

Ting-Chen Hu

Ryan Enright

Mark P Earnshaw

Examples of the disclosure relate to an apparatus. The apparatus includes a housing portion and a flexible portion. The housing portion includes one or more heat sources. The flexible portion is configured to be moved between a closed configuration and an open configuration wherein in the closed configuration the flexible portion is housed in the housing portion and in the open configuration the flexible portion is positioned outside of the housing. The flexible portion includes a flexible display and an oscillating heat pipe. The oscillating heat pipe is coupled to the one or more heat sources in the housing portion. The oscillating heat pipe is flexible and configured to move with the flexible portion between the closed configuration and the open configuration. One or more condenser regions of the oscillating heat pipe are positioned in the flexible portion.

Cooling apparatus

An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.

Apparatus for cooling electronic circuitry components and photonic components

An optical data transmitter having M serially optically connected electro-absorption modulators (EAMs) individually driven using ON-OFF-keying (OOK) electronics, where M is an integer greater than one. In an example embodiment, the optical data transmitter can be used to generate an intensity-modulated optical signal carrying symbols of a 2-level unipolar pulse-amplitude-modulation constellation. The OOK electronics enables the DC bias voltages and/or AC amplitudes of the two-level drive signals applied to different EAMs to be individually controllable to achieve desired uniform or non-uniform separation between the constellation levels. In at least some embodiments, temperatures of different EAMs may also be individually controllable. In various embodiments, the EAMs may operate in reflection or in transmission.

Apparatus comprising serially connected electro-absorption modulators

A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro-structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro-scale dimensions.

Embedded microfluidic distribution apparatus for passively cooling optoelectronic devices

A photonic integrated circuit includes a slot optical waveguide having an optical core with sub-wavelength slot therein that is partially filled with a first lower-index material having a negative thermo-optic coefficient. The slot may also include a second lower-index material having a positive thermo-optic coefficient. The relative volume of the first lower-index material within the slot may be configured to provide athermal or nearly-athermal operation. Example applications include integrated AWG MUX/DEMUX devices, Mach-Zehnder modulators, and micro-ring resonators or modulators implemented with silicon-based or silicon-nitride based slot waveguides with reduced sensitivity to temperature changes.

Thermally compensated slot waveguide

Photonic integrated circuits utilizing interferometric effects, such as wavelength multiplexers/demultiplexers, include a free-space coupling region having two core layers that have thermo-optic coefficients of opposite sign. The two core layers are configured to provide athermal or nearly-athermal operation. Described examples include integrated array waveguide grating devices and integrated echelle grating devices. Example material systems include LNOI and SOI.

Integrated optical multiplexer / demultiplexer with thermal compensation

Optical transmitters, receivers, and transceivers implemented using a plurality of surface-coupled optical devices that can be manufactured on the same planar substrate and then post-processed to provide some of the devices with different respective partially transparent front mirrors compatible with and/or customized for different respective optical functions. When appropriately electrically biased and driven, different subsets of such devices can operate as lasers, optical modulators, optical amplifiers, and photodetectors, respectively. In this manner, an integrated array of such devices can be customized to provide the optical functions needed for the intended product. For example, an optical transmitter can be constructed using an integrated array that comprises three surface-coupled optical devices configured to operate as a laser, an optical modulator, and an optical amplifier, respectively. An optical receiver can be constructed using an integrated array that comprises two surface-coupled optical devices configured to operate as an optical amplifier and a photodetector, respectively.

Communication system employing surface-coupled optical devices

An optical data transmitter in which surface-coupled reflective electro-absorption modulators are placed into different interferometer arms and operated in a manner that enables the optical data transmitter to transmit an optical output signal modulated using PAM, QPSK, or QAM modulation. In some embodiments, the optical data transmitter is configured to generate a PDM optical output signal by using two such interferometers and a quarter-wavelength plate configured to cause the output polarizations of the two interferometers to be mutually orthogonal. The electro-absorption modulators are surface-coupled in the sense that, in operation, each of these devices receives input light and outputs modulated light along a direction that is substantially orthogonal to the main plane of the device. In an example embodiment, an electro-absorption modulator includes a PIN diode comprising an MQW structure and implemented using a stack of relatively thin semiconductors layers that are parallel to the main plane of the device.

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Springfield, NJ, United States of America

Stefano Grillanda