Lumentum Technology UK Limited

Oclaro Technology Limited

Oclara Technology Limited

Stefano Balsamo

Marco Villa

Flavio Dell'Orto

Paolo Vergani

Giuseppe Cusmai

Mario Bonazzoli

Luigi Gobbi

Michele Belmonte

Nicola Rettani

Haydn Jones

There is described an RF waveguide array. The array comprises a substrate comprising a plurality of optical waveguides, each waveguide being elongate in a first direction. An electrical RF transmission line array is located on a face of the substrate and comprises a plurality of signal electrodes and a plurality of ground electrodes, each electrode extending in the first direction. Each signal electrode is positioned to provide a signal to two respective waveguides. The ground electrodes include at least one intermediate ground electrode positioned between each pair of signal electrodes. Each intermediate ground electrode includes a portion extending into the substrate.

Waveguide array

A chip comprising a bonding pad region and a transmission section. The bonding pad region has a first impedance, and is configured for electrical connection to an external transmission line. The transmission section extends away from the bonding pad region and has a second impedance. The bonding pad region is configured to enable field confinement and field matching between the bonding pad region and the external transmission line, and the second impedance is not equal to the first impedance.

Optimised RF input section for coplanar transmission line

An electro-optic modulator. The modulator is made as a plurality of discrete elements, and adjacent elements abut such that there are no free space optics between adjacent discrete elements. The modulator comprises a radio frequency, RF, element configured to modulate light passing through the element based on an electrical RF input. The plurality of discrete elements comprises a first set of discrete elements fabricated from thin film lithium niobate, TFLN, and a second set of discrete elements fabricated from silicon photonics, SiPh. The first set of discrete elements comprises the RF element.

Modulator assembly

The invention relates to a folded Mach-Zehnder modulator. The modulator may comprise a beam splitter configured to split an input light beam into a plurality of light beams. The modulator may comprise a plurality of Mach-Zehnder devices configured to receive one or more of the plurality of light beams. The modulator may comprise a U-turn section configured to receive light beams from the Mach-Zehnder devices and to change the direction of the light beams by substantially 180 degrees. The modulator may comprise a polarization management section configured to combine light beams received from the U-turn section and to output a polarization multiplexed phase modulated light beam.

Optical modulator

An electro-optic devicecomprising a substrate in which first and second waveguidesare formed. The device also comprises first and second electrodescomprising an optically transparent conductive material and including primary portionsoverlying the first and second waveguidesfor electrically biasing the first and second waveguides. The device is configured such that one of the first and second electrodes includes one other portionarranged alongside the primary portionof the other of the first and second electrodes. This arrangement improves the electro-optic efficiency of the device without the need for a buffer layer in the electrodes.

Electro-optic devices

A photonic assembly is described. The assembly comprises a substrate. An optical modulator () in or on the substrate has an output port coupled to an output waveguide () mounted in or on the substrate. A spiller waveguide () is mounted in or on the substrate. The spiller waveguide () has an input end () physically separated from but proximate to the output waveguide () so as to collect light spilt from the output port or output waveguide (). The modulator () may be a MZI modulator.

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Milan, Italy

Stefano Balsamo