Average Co-Inventor Count = 3.17
ph-index = 6
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Intel Corporation (19 from 54,858 patents)
19 patents:
1. 12113026 - Multi-chip package and method of providing die-to-die interconnects in same
2. 12002762 - High density organic bridge device and method
3. 11876053 - Multi-chip package and method of providing die-to-die interconnects in same
4. 11824008 - Multi-chip package and method of providing die-to-die interconnects in same
5. 10923429 - Multi-chip package and method of providing die-to-die interconnects in same
6. 10770387 - Integrated circuit package substrate
7. 10763216 - Multi-chip package and method of providing die-to-die interconnects in same
8. 10672713 - High density organic bridge device and method
9. 10510669 - Multi-chip package and method of providing die-to-die interconnects in same
10. 10325843 - Integrated circuit package substrate
11. 10103105 - High density organic bridge device and method
12. 9875969 - Multi-chip package and method of providing die-to-die interconnects in same
13. 9831169 - Integrated circuit package substrate
14. 9548264 - High density organic bridge device and method
15. 9508636 - Integrated circuit package substrate