Atotech Deutschland Gmbh

Stefanie Ackermann

Heiko Brunner

Dirk Rohde

Olivier Mann

Timo Bangerter

Josef Gaida

Lars Kohlmann

Andreas Kirbs

Bernd Roelfs

Angela Llavona-Serrano

Jan Sperling

Michael Merschky

Agnieszka Witczak

Grigory Vazhenin

Thomas Thomas

Mauro Castellani

Fabian Michalik

Markku Lager

Marco Haryono

Pamela Cebulla

Christian Ohde

Bernd Froese

Angelo Ferro

Andre Schmökel

Kinga Haubner

The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.

Azole silane compound

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

Metal or metal alloy deposition composition and plating compound

An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising 

Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper plating bath composition

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Berlin, Germany

Stefanie Ackermann