H.c. Starck Gmbh

Cytena Bioprocess Solutions Co., Ltd.

Hoganas Germany Gmbh

H.c. Starck Surface Technology and Ceramic Powders Gmbh

Stefan Zimmermann

Steven Alfred Miller

Mark E Gaydos

Scott Jeffrey Volchko

Prabhat Kumar

William Loewenthal

Shuwei Sun

Olaf Schmidt-Park

Leonid Natan Shekhter

Michael Thomas Stawovy

Peter Koltay

Richard Wu

Andre Gross

Jonas Schöndube

Cheng-Han Tsai

Uwe Papp

Jonas Schondube

Tsai Chenghan

Gary Alan Rozak

Benno Gries

Frank Schrumpf

Francois-Charles Dary

Heinrich Kreye

Aloys Eiling

Rong-chein Richard Wu

Tobias Schmidt

Steve Miller

Jürgen Fischer

Peter Thienel

Roland Scholl

Hans Keller

The invention relates to a device for processing a liquid sample, comprising a carrier that has at least one well for receiving the liquid sample, a processing unit for carrying out at least one processing step, and an actuating apparatus, which has an electrical control or regulating unit for controlling or regulating the processing step carried out by means of the processing unit, wherein the actuating apparatus, in particular the control or regulating unit, is mounted on the processing unit. The device is characterized in that the processing unit is mounted on the carrier.

Device for processing a liquid sample

The invention relates to a method for processing a liquid sample situated in a receptacle, wherein an attachment device is attached to the receptacle such that at least one fluid line protrudes into the liquid sample and a fluid is directly dispensed into the liquid sample through the fluid line and/or a portion of the liquid sample is aspirated into the fluid line.

Method for processing a liquid sample

The invention provides for a cermet powder containing

Metal powder

In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and rejuvenated by, e.g., cold spray, is utilized in sputtering processes to produce metallic thin films.

Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom

In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.

Methods of manufacturing large-area sputtering targets using interlocking joints

A cermet powder includes a) from 50 to 90 wt-% of at least one hard material, and b) from 10 to 50 wt-% of a matrix metal composition. The wt.-% for a) and b) are based on a total weight of the cermet powder. The matrix metal composition comprises i) from 40 to 75 wt-% of iron and nickel, ii) from 18 to 35 wt-% of chromium, iii) from 3 to 20 wt.-% of molybdenum, and iv) from 0.5 to 4 wt-% of copper. The wt-% for i) to iv) are based in each case on a total weight of the matrix metal composition. A weight ratio of iron to nickel is from 3:1 to 1:3.

Cermet powder

Large-area sputtering targets

In various embodiments, protective layers are bonded to a steel layer, overlapped, and at least partially covered by a layer of unmelted metal powder produced by cold spray.

Methods of joining metallic protective layers

In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and comprising a sputtering-target material is provided, the sputtering-target material (i) comprising a metal, (ii) defining a recessed furrow therein, and (iii) having a first grain size and a first crystalline microstructure. A powder is spray-deposited within the furrow to form a layer therein, the layer (i) comprising the metal, (ii) having a second grain size finer than the first grain size, and (iii) having a second crystalline microstructure more random than the first crystalline microstructure. Spray-depositing the powder within the furrow forms a distinct boundary line between the layer and the sputtering-target material.

Methods of rejuvenating sputtering targets

Disclosed is a process for the reprocessing or production of a sputter target or an X-ray anode wherein a gas flow forms a gas/powder mixture with a powder of a material chosen from the group consisting of niobium, tantalum, tungsten, molybdenum, titanium, zirconium, mixtures of two or more thereof and alloys thereof with at least two thereof or with other metals, the powder has a particle size of 0.5 to 150 &#x3bc;m, wherein a supersonic speed is imparted to the gas flow and the jet of supersonic speed is directed on to the surface of the object to be reprocessed or produced.

Method for coating a substrate surface and coated product

In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.

A joined sputtering target comprising a sputtering material is formed by disposing two discrete sputtering-target tiles comprising the sputtering material proximate each other, thereby forming an interface between the tiles, the interface comprising at least one of an interlocking joint therein or a recess in a top surface thereof, and spray-depositing a spray material over at least a portion of the interface, thereby joining the tiles to form the joined sputtering target.

Methods of manufacturing high-strength large-area sputtering targets

In various embodiments, sputter-target formation includes application of a layer having an intermediate coefficient of thermal expansion between the backing plate and the target material.

Growing community of inventors

Bad Saeckingen, Germany

Stefan Zimmermann