Bystronic Laser Ag

Stefan Wittwer

Simon Scheidiger

Andreas Lüdi

Thomas Rataj

Thomas Reber

Jürg Steffen

A beam shaper () for shaping a laser beam is provided, including a first beam shaping section () designed for shaping a central part of the laser beam, and a second beam shaping section () designed for shaping a peripheral part of the laser beam. Moreover, a device for laser beam treatment of a workpiece and a method for laser beam treatment of a workpiece are provided.

Beam shaper and use thereof, device for laser beam treatment of a workpiece and use thereof, method for laser beam treatment of a workpiece

A high current contact is disclosed having a contact pin for insertion into the high-current socket having a plurality of contact segments that are slotted in a radial direction for contacting an inner contact surface of the high-current socket; a guide sleeve surrounding the contact pin, which, by means of an at least central front pressing against the high-current socket relative to the contact pin in an axial direction from an initial position, in which the guide sleeve blocks an independent radial spreading of the contact segments in order to avoid a contact between the contacts segments protruding axially from the guide sleeve and the inner contact surface, is movable into a contact position that is set back with respect to the contact pin and in which the guide sleeve unblocks an independent radial spreading of the contact segments protruding from the guide sleeve for contacting the inner contact surface.

Automatic parameterisation of a laser cutting method

A laser beam machining device () is provided, in which unfocused light (A) from a light exit point (B) is radiated onto a single lens (), where in the lens () focuses the laser light (A) and guides it onto a machining point of a work piece (). A distance (m, m) between the lens () and the light exit point (B) and a distance (l, l) between the lens () and the machining point of the workpiece () and a distance between the light exit point (B) and the aforementioned machining point can be varied. Moreover, a process of usage of a laser beam machining device () is provided.

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Herzogenbuchsee, Switzerland

Stefan Wittwer