Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Stefan Weiss

Elke Zakel

Ghassem Azdasht

Volker Kirchhoff

Paul Kasulke

Jörg Kubusch

Gösta Mattausch

Rainer Labitzke

Jorg Gwiasda

Henrik Flaske

Achim Kloeser

Hans Hermann Oppermann

Habib Badrihafifekr

Severin Dominok

Burkhard Zimmermann

Meyer Björn

Mattausch Gösta

An apparatus for suppression of arcs in an electron beam generator including: a first module providing an operating voltage; a second module including a coil suitable for a voltage of at least 10 kV, and at least one free-wheeling diode connected in parallel to the coil; a third module including a first circuit component configured to detect a first actual value for electric voltage, and a first signal is producible when the first actual value falls below a first threshold value, a second circuit component by which a second actual value for electric current is detectable, and a second signal is generated when the second actual value exceeds a second threshold value, a control logic, which optionally links the first and second signals and a resultant output signal is producible; a semiconductor-based switch suitable for the voltage of at least 10 kV, which is opened based on the output signal.

Apparatus for suppression of arcs in an electron beam generator

A connecting structure (23) for establishing a thermal connection between at lest two components (21, 22) composed of materials with different expansion coefficients, wherein at least one component forms an electronic power element (21) and higher-melting-point materials are used for the contacting, which higher-melting-point materials form isolated connecting elements (29) between the contact surfaces (27, 28) of the components (21, 22).

Thermal connecting structure for connecting materials with different

Process for remelting a contact surface metallization

A method of joining an electronic component (10) provided with contact surfaces (12) to a substrate (11) comprising contact surfaces (14) via contact metal coatings (16, 17) formed between the contact surfaces and made of a solderable or weldable joining material (15), the electronic component and the substrate being pressed together and heated, and during the joining operation a layer (18) of a medium (19) containing a polyalcohol is disposed at least between the joining material (15) and the contact surfaces (12) of the electronic component (10) or the substrate (11).

Method of surface-contacting electronic components

Growing community of inventors

Berlin, Germany

Stefan Weiss