Infineon Technologies Ag

Stefan Wein

Bernd Goller

Gerald Ofner

Robert-Christian Hagen

Christian Stuempfl

Josef Thumbs

Holger Wörner

Holger Woerner

Christian St&uuml;mpfl

Holger W&ouml;rner

Christian Stümpfl

Robert Christian Hagen

An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.

Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

Electronic component with a plastic package and method for production

The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip carrier are formed by strips of material that can undergo microstructuring and that are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component.

Electronic component with at least one semiconductor chip and method for its manufacture

An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semiconductor chip on a rewiring substrate.

Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device

An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of a metal-clad base plate. Ideally, a panel having a number of component positions is provided for receiving a number of such an electronic component.

Universal package for an electronic component with a semiconductor chip and method for producing the universal package

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component

An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

Growing community of inventors

Wuppertal, Germany

Stefan Wein