Pink Gmbh Thermosysteme

Pink Gmbh Vakuumtechnik

Stefan Weber

Alfred Kemper

The present invention relates to a method and device () for the temperature treatment of workpieces () or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber () which is sealed from the surrounding area, wherein the heating and the cooling of the component () are carried out in two chamber regions () of the process chamber (), which can be separated from one another by means of a condensation device ().

Method and device for heat treatment, especially connection by soldering

A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier. At least one component is heated in a melt chamber ( ) in a process atmosphere which is sealed off from the environment. In a subsequent step the component is cooled in a cooling chamber ( ) in a process atmosphere which is sealed off from the environment. The component is heated and cooled in process chamber ( ) which are independent of each other.

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Wertheim, Germany

Stefan Weber