Epcos Ag

Stefan Seitz

Anton Leidl

Hans Krueger

Wolfgang Pahl

Alois Stelzl

Gregor Feiertag

Wolfgang Sauer

The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S) is closed; and a second sound inlet opening (S) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S) is prepared but closed.

MEMS microphone and method for producing the MEMS microphone

A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

MEMS package and method for the production thereof

A capacitor includes a multi layer structure on a ceramic or crystalline substrate. The multilayer structure includes a lower electrode, an upper electrode, and a dielectric that is tunable by a voltage applied to the electrodes. The multilayer structure is configured such that resonant oscillation modes of bulk acoustic waves can be propagated in the multilayer structure and such that the resonant frequencies of the oscillation modes are outside a first band range of between 810 and 1000 MHz, second band range of between 1700 and 2205 MHz and third band range of between 2400 and 2483.5 MHz.

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Windach, Germany

Stefan Seitz