Robert Boschgmbh

Stefan Pinter

Joerg Muchow

Tjalf Pirk

Christoph Friese

Joachim Fritz

Simon Armbruster

Rainer Straub

Christoph Schelling

Hubert Benzel

Helmut Grutzeck

Helmut Baumann

Frederic Njikam Njimonzie

Benjamin Steuer

Frieder Haag

Frank Fischer

Heribert Weber

Frank Schatz

Kurt Weiblen

Ning Wang

Johannes Baader

Matthias Illing

Jochen Tomaschko

Georg Bischopink

Hartmut Kueppers

Alexander Huebel

Dietmar Haberer

Hans Artmann

Michael Offenberg

Frank Reichenbach

Dietrich Schubert

Torsten Kramer

Andreas Duell

Zoltan Lestyan

Frank Henning

Matthias Fuertsch

Michael Krueger

Jan Niklas Caspers

Matthias Boehringer

Franz Laemer

Markus Lutz

Mirko Hattass

Horst Muenzel

Jochen Franz

Thorsten Balslink

Heiko Stahl

Hans-Peter Trah

Juergen Kurle

Friedjof Heuck

Kerrin Doessel

Michael Knauss

Mohamad Iyad Al Dibs

Harald Emmerich

Holger Hoefer

Lars Metzger

Michael Fehrenbach

Stefan Finkbeiner

Daniel Pantel

Daniel Haug

Robert Sattler

Sebastian Reiss

Raschid Baraki

Sebastian Schuler-Watkins

Martin Schoefthaler

Stefan Mark

Franziska Rohlfing

Wolfram Schock

Ralf Schellin

Frieder Sundermeier

Tobias Henn

Philip Kaupmann

Wolfgang Heinzelmann

Karl Bender

Nicolas Schorr

Juergen Kober

Steffi Lindenkreuz

Jurgen Kurle

Heiko Nitsche

Uma Krishnamoorthy

Simon Ambruster

Nico Greiner

Tina Steigert

Gerhard Kiesewetter

A method for producing a plurality of sensor devices. The method includes: furnishing a substrate having contact points in a plurality of predetermined regions for sensor chips; disposing the sensor chips in the predetermined regions on the substrate, and electrically contacting the sensor chips to the contact points; attaching a frame structure with an adhesive material on the substrate and between the sensor chips, the frame structure proceeding laterally around the sensor chips, the frame structure extending, after attachment, vertically beyond the sensor chips and forming a respective cavity for at least one of the sensor chips, and a membrane spanning at least one of the cavities for the sensor chips so as to cover it; and singulating the substrate, or the frame structure and the substrate, around the respective cavities into several sensor devices.

Method for producing a plurality of sensor devices, and sensor device

A micromechanical sensor device and a corresponding manufacturing method are described. The micromechanical sensor device is fitted with a substrate including a front side and a rear side; a micromechanical sensor chip including a sensor area attached to the front side of the substrate; and a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip. The capping unit surrounds the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip. A mold package is formed above the capping unit.

Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method

A method for producing a micromechanical device having inclined optical windows, and a corresponding micromechanical device are described. The production method includes: providing a first substrate having a front side and a rear side; forming a plurality of spaced-apart through holes in the first substrate which are arranged along a plurality of spaced-apart rows in the first substrate; forming a respective continuous beveled groove along each of the rows, the grooves defining a seat for the inclined optical windows; and inserting the optical windows into the grooves above the through holes.

Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device

A production method for a micromechanical device having inclined optical windows. First and second substrates are provided. A plurality of through-holes is produced in the first and second substrate such that for each through-hole in the first substrate a congruent through-hole is produced in the second substrate, which overlap when the first substrate is placed over the second substrate. A slanted edge region is produced around a respective through-hole in the first and second substrate, the edge region being inclined at a window angle, two slanted edge regions situated on top of each other being congruent in a top view and being inclined at the same window angle. A window foil is provided having a structured window region, which covers the through-hole in a top view of the window foil in each case, the window foil forming an optical window slanted at the window angle above the respective through-hole.

Production method for a micromechanical device having inclined optical windows, and micromechanical device having inclined optical windows

An optical switch includes a bus waveguide supported by a substrate, an actuation electrode supported by the substrate, the actuation electrode having fins that protrude in a direction perpendicular to the substrate and to the bus waveguide, and a reaction electrode having interdigitated fins configured to form a comb drive with the actuation electrode. When a voltage difference between the reaction electrode and the actuation electrode is less than a lower threshold, the reaction electrode is positioned a first distance from the bus waveguide, when the voltage difference between the reaction electrode and the actuation electrode is greater than an upper threshold, the reaction electrode is positioned a second distance from the bus waveguide, and the second distance is less than the first distance.

MEMS optical switch with stop control

An optical switch includes a first bus waveguide supported by a substrate, an optical antenna suspended over the first bus waveguide via a spring, and interdigitated electrodes coupling the substrate with optical antenna and configured to control a position of the optical antenna relative to the first bus waveguide. When a voltage difference applied to the interdigitated electrodes is less than a lower threshold, the optical antenna is at a first position offset from the first bus waveguide, when the voltage difference applied to the interdigitated electrodes is greater than an upper threshold, the optical antenna is at a second position offset from the first bus waveguide, and the offset at the second position is greater than at the first position.

In-plane MEMS optical switch

An optical switch includes a bus waveguide supported by a substrate, a coupling waveguide suspended over the bus waveguide, a reaction electrode coupled with, and adjacent to, the coupling waveguide, an actuation electrode supported by the substrate and configured to control a position of the coupling waveguide relative to the bus waveguide via the reaction electrode, and an optical antenna coupled with the coupling waveguide and disposed at a fixed distance from the bus waveguide. When a voltage difference between the reaction electrode and the actuation electrode is less than a lower threshold, the coupling waveguide is positioned a first distance from the bus waveguide, when the voltage difference between the reaction electrode and the actuation electrode is greater than an upper threshold, the coupling waveguide is positioned a second distance from the bus waveguide, and the second distance is less than the first distance.

MEMS optical switch with a cantilever coupler

A micromechanical apparatus and a corresponding production method are described. The micromechanical apparatus encompasses a base substrate having a front side and a rear side; and a cap substrate, at least one surrounding trench having non-flat side walls being embodied in the front side of the base substrate; the front side of the base substrate and the trench being coated with at least one metal layer; the non-flat side walls of the trench being covered nonconformingly with the metal so that they do not form an electrical current path in a direction extending perpendicularly to the front side; and a closure, in particular a seal-glass closure, being embodied in the region of the trench between the base substrate and the cap substrate.

Micromechanical device and corresponding production method

A manufacturing method for a micromechanical window structure including the steps: providing a substrate, the substrate having a front side and a rear side; forming a first recess on the front side; forming a coating on the front side and on the first recess; and forming a second recess on the rear side, so that the coating is at least partially exposed, whereby a window is formed by the exposed area of the coatings.

Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure

A micromechanical component having a mount, an adjustable element, which is connected via at least one spring to the mount, and an actuator device, a first oscillatory motion of the adjustable element about a first axis of rotation and simultaneously a second oscillatory motion of the adjustable element, which is set into the first oscillatory motion, being excitable about a second axis of rotation in response to the actuator device; and the adjustable element being configured by the at least one spring to be adjustable on the mount in such a way that the adjustable element is adjustable by a resulting angular momentum about a rotational axis, which is oriented orthogonally to the first axis of rotation and orthogonally to second axis of rotation. Also, a method for manufacturing a micromechanical component. Moreover, a method for exciting a motion of an adjustable element about a rotational axis.

Micromechanical component having an oscillator, a method for the manufacture thereof, and a method for exciting a motion of an adjustable element about a rotational axis

A method for manufacturing a protective wafer including a frame wafer and an optical window, and to a method for manufacturing a micromechanical device including such a protective wafer having an inclined optical window. Also described are a protective wafer including a frame wafer and an optical window, and a micromechanical device including a MEMS wafer and such a protective wafer, which delimit a cavity, the protective wafer including an inclined optical window.

Protective wafer including inclined optical windows and device

A method for forming a cavity in a silicon substrate, a surface of the silicon substrate having a tilting angle relative to a first plane of the silicon substrate, and the first plane being a {111} plane of the silicon substrate, and situation of an etching mask on the surface of the silicon substrate. The etching mask has a retarding structure that protrudes into the mask opening, and a first etching projection region. All further edges of the mask opening outside the first etching projection region are situated essentially parallel to {111} planes of the silicon substrate. The method includes an anisotropic etching of the silicon substrate during a defined etching duration. An etching rate in the &#x3c;111&#x3e; directions of the silicon substrate is lower than in other spatial directions, and the first retarding structure is undercut in a first undercut direction going out from the first etching projection region.

Method for forming a cavity and a component having a cavity

An actuator device and a method for tilting an actuator device. The method includes the steps: conducting electrical current through an electrical conduction device, which is guided via a tilting device of the actuator device, within a first magnetic field that is generated by a permanent magnet device of the actuator device, so that an actuator element of the tilting device is tilted along a first tilting axis as the result of a Lorentz force; and generating a second magnetic field by an electromagnet device of the actuator device in the area of the permanent magnet device, so that the tilting device is tilted along a second tilting axis as the result of magnetic attraction and repulsion.

Micromechanical actuator device and method for tilting a micromechanical actuator device

A magnetic actuator includes: a plate having a main plane of extent and mounted rotatably about at least one first axis of rotation which is parallel to the main plane of extent, the plate having at least one conductor loop parallel to the main plane of extent; a magnetic bracket situated beneath the plate and having a U-shaped magnetic flux conducting rail and a hard magnet whose magnetization is perpendicular to the U-shaped opening, the magnetic bracket and the plate being aligned with one another in such a way that the opening in the magnetic bracket points toward the main plane of extent of the plate, the U-shaped magnetic flux conducting rail having a main direction of extent parallel to the first axis of rotation, and the plate being deflectable about the at least one axis of rotation by energizing the at least one conductor loop.

Magnetic actuator

A method for creating a nanostructure in a transparent substrate, including a) applying a first structure carrier layer having a defined thickness onto at least one surface of the substrate; b) forming a nanostructure in the first structure carrier layer; and c) oxidizing the first structure carrier layer.

Method for creating a nanostructure in a transparent substrate

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Reutlingen, Germany

Stefan Pinter