Siemens Aktiengesellschaft

Siemens Aktiengesell Schaft

Stefan Pfefferlein

Thomas Bigl

Stephan Neugebauer

Alexander Hensler

Ewgenij Ochs

Ulrich Wetzel

Klaus Wilke

Jörg Strogies

Bernd Kürten

Philipp Oschmann

Ronny Werner

The invention relates to a housing () for an electrical appliance () comprising a housing body () which at least partially houses an electrical component () of the electrical appliance (), the housing body () having at least one support point () for being supported on a plate () to which the electrical component () is connected, the housing () also having at least one temperature sensor () for sensing the temperature of the plate (), each temperature sensor () being arranged in the housing body () in the region of a support point (). The invention also relates to an electrical appliance () comprising at least one electrical component (), at least one plate (), which is connected in each case to the electrical component (), and at least one housing () of the aforementioned kind, the housing body () being supported at the support point () on the plate (). In order to provide, amongst other things, an improved electrical appliance (), it is proposed that the housing body () has, in each case, a single-pole electrical line () to the temperature sensor ().

Housing and electrical appliance

An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.

Electronic circuit, power converter, and method for producing an electronic circuit

A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.

Cooling device with fiber attachment between heating tube and cooling element

A semiconductor assembly includes a carrier element with a first carrier element conductor path, a semiconductor chip, an electrically insulating element having a first insulating element conductor path, and a first spacer element. The semiconductor chip is connected electrically and mechanically on a first semiconductor side via a first connecting material to the first carrier element conductor path. The semiconductor chip is connected on a second semiconductor side, which faces away from the first semiconductor side of the semiconductor chip, via a second connecting material to the first insulating element conductor path, which is arranged on a first insulating element side of the electrically insulating element. The first spacer element is arranged for maintaining a distance between the carrier element and an assembly element facing toward the second semiconductor side of the semiconductor chip and is connected mechanically to both the carrier element and the assembly element.

Semiconductor assembly and method of producing the semiconductor assembly

A circuit carrier includes a first side, two layers arranged to define an intermediate space there between, with at least one of the two layers being electrically conductive and attached to the first side. The at least one of the two layers has a region deformed such as to exhibit an indentation and has a trace structure in the indentation. A first insulating material fills the intermediate space, and a second insulating material fills the indentation, A second side in opposition to the first side is shaped to have in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.

Circuit carrier, package, and method for manufacturing a package

A method for producing an electric circuit in which a contact carrier comprising a first contact area and a second contact area is provided. An insulating body is applied to the circuit carrier and at least partially covers the first contact area and the second contact area. The insulating body comprises cut-outs in regions both contact areas. A flowable electrical conducting medium is introduced into the insulating body.

Method for producing an electric circuit comprising a circuit carrier, contact areas, and an insulating body

A power module includes a substrate having a first layer and a second layer which are connected to one another and arranged above one another. The first layer includes a first dielectric material having a metallization arranged on a side facing the second layer and the second layer includes a second dielectric material having a metallization arranged on a side facing away from the metallization of the first dielectric material. A power semiconductor having a first contact area and a second contact area opposite the first contact area is connected to the metallization of the first dielectric material via the first contact area and arranged in a first recess of the second layer. A metallic first encapsulation encapsulates the power semiconductor in a fluid-tight manner, with the second contact area of the power semiconductor being electrically conductively connected to the metallization of the second dielectric material via the first encapsulation.

Power module having at least one power semiconductor

A semiconductor assembly includes a semiconductor element having contacts on a first surface electrically connected with contacts of a carrier element by electrically conductive material. A second surface opposite the first surface has a convex curvature with a first radius or a concave curvature with a second radius. The second surface of the convex curvature or the second surface of the concave curvature is connected in a positive-fit manner to a cooling body surface of a concave cooling body curvature of the cooling body, and, during operation at a selected barrier layer temperature, the first radius of the convex curvature deviates by at most 10% from a third radius of the concave cooling body curvature, or the second radius of the concave curvature deviates by at most 10% from a fourth radius of the convex cooling body curvature.

Semiconductor assembly

An electrical converter having pluggable converter components includes a first electronic assembly having electronic parts an assembly carrier, a housing chassis and a housing cover, wherein at least one of the electronic parts is a power semiconductor switch having a wide band gap and made of GaN or of InGaN. The power semiconductor switch is operated with a reverse bias of at least 400 V and at a clock frequency of at least 40 kHz during operation of the electrical converter. The first electronic assembly is mechanically plugged into the assembly carrier by connecting elements, and the first electronic assembly together with the assembly carrier is mechanically plugged and locked by further connecting elements to the housing chassis or to the housing cover using corresponding locking elements on the housing chassis or to the housing cover, respectively.

Electrical converter

A cooling apparatus for cooling an electronic component includes a heat sink, a heat sink cover to close a top area opening of the heat sink, a tube-shaped cooling element arranged inside the heat sink for some cooling ribs of the heat sink in mechanical contact with an outer side of the tube-shaped cooling element, and an impeller with blades for generating a cooling flow of a cooling medium. The tube-shaped cooling element forms a first cooling duct to conduct the cooling flow in a first cooling flow direction. A second cooling duct opposite the first cooling duct is formed between an inner area of the heat sink and the outer side of the tube-shaped cooling element to conduct the cooling flow in a second cooling flow direction. The cooling flow is redirected from the first cooling duct to the second cooling duct or vice versa.

Cooling apparatus

A semiconductor module includes a substrate composed of electrically insulating material. A structured metal layer for contact with an electrical component is applied to a top side of the substrate. The structured metal layer is applied to the substrate only in a central region of the substrate, so that an edge region which surrounds the central region and in which the structured metal layer is not applied to the substrate remains on the top side of the substrate. A contact layer for making contact with a cooling body is situated opposite the structured metal layer and applied to a bottom side of the substrate in the central region. A structured supporting structure is further applied to the bottom side of the substrate in the edge region and has a thickness which corresponds to a thickness of the contact layer.

Semiconductor module with a supporting structure on the bottom side

Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.

Electronic assembly with a component arranged between two circuit carriers, and method for joining such an assembly

An electrical circuit arrangement has at least one capacitor () and at least one other circuit part () electrically cooperating with the first capacitor (). The first capacitor () is part of a first capacitor arrangement () which annularly surrounds the cavity (). The other circuit part () is provided at least partially within the cavity () and is electrically connected to the first capacitor (). The first capacitor arrangement () has fastening elements () by means of which the circuit arrangement can be mechanically fastened to a holding element ().

Electrical circuit arrangement having a capacitor with a housing function

A circuit board with a conductor path having a recess, an implant with left, right, lower and upper edges arranged in the recess, where the implant has first and second optical layers, a second optical layer and a conductor arranged between them, the first and the second optical layer each have at least one light-conducting structure with first and second ends, where a light-conductor is arranged in a right edge of the implant, in which respective second ends of the light-conducting structures are located, such that light fed in at the first end of the optical fiber of the first optical layer is deflected to the second end of the light-conducting structure of the second optical layer such that a beam path of the light encompasses the conductor, and the circuit also includes an optical transmitter and an optical receiver with and evaluator that form a fiber optic current sensor.

Growing community of inventors

Heroldsberg, Germany

Stefan Pfefferlein