Infineon Technologies Ag

Other

Motorola Corporation

Infineon Technologies Sc300 Gmbh & Co., Kg

Stefan Ottow

Volker Lehmann

Hermann Wendt

Hans Reisinger

Dan Wissel

Rainer Leuschner

Reinhard J Stengl

Gerrit Lange

Martin Welzel

Terry Alan Breeden

Michael Thomas Tucker

Ulf Steuer

Kim Woosik

Wolfram K&ouml;stler

Reinhard Stengel

A method of treating a substrate in manufacturing a magnetoresistive memory cell includes performing a cleaning operation on the substrate using a mask layer as a protection layer for etching of a peripheral via. Further, an etch stop layer can used as a protection layer in a cleaning operation on the substrate.

Method of treating a substrate in manufacturing a magnetoresistive memory cell

An apparatus for measuring the water content of a water-containing liquid mixture contained in a tight chemistry tank includes a heating device for controlling the temperature of the liquid mixture to a temperature near the boiling point of the liquid mixture, a cooling medium system disposed at the top of the tight chemistry tank having a cooling medium inlet and a cooling medium outlet, a temperature measurement system for determining the temperature difference between the cooling medium inlet and outlet, and a computing device for calculating the water content of the liquid mixture from the temperature difference. Also provided is a tank for supplying water to the liquid mixture, and a control system for adjusting the amount of water supplied from the tank based upon the water content measured by the measuring apparatus. Also provided is a method for measure the water content.

Method and apparatus for measuring and controlling the water content of a water-containing liquid mixture

A reactor configuration contains a housing connected to a silicon wafer. The silicon wafer has pores extending from a first main area of the silicon wafer into an interior of the silicon wafer, preferably as far as a second main area of the silicon wafer. A catalyst layer at least partly covers the surface of the pores.

Reactor configuration and method for producing it

An apparatus for assessing a silicon dioxide content of a phosphoric acid bath for etching silicon nitride and a system for etching silicon nitride bath utilize a sensor. In particular, the apparatus for assessing the silicon dioxide content of a phosphoric acid bath for etching silicon nitride of the present invention contains a sensor for measuring the NH concentration of the phosphoric acid bath, a storage unit for storing data which define a relationship between the silicon dioxide content and the NH concentration, and a device for calculating the silicon dioxide content of the basis of the measured NH concentration and the stored data.

Apparatus for assessing a silicon dioxide content

A recycling procedure for 300 mm nitride dummy wafers which have a stabilization layer of silicon dioxide is provided. The recycling procedure is essentially based on selectively wet etching the deposited silicon nitride with respect to the silicon dioxide stabilization layer, preferably with hot phosphoric acid at 160&deg; C. In particular, a method of handling a silicon wafer which is employed as a dummy wafer during a nitride deposition process includes the steps of depositing a silicon dioxide layer on the wafer surface, performing the nitride deposition process on the wafer to deposit silicon nitride or silicon oxinitride on the wafer surface until a predetermined layer thickness is reached, and etching the silicon nitride or silicon oxinitride layer selectively with respect to the silicon dioxide layer.

Method of handling a silicon wafer

A substrate made from silicon has a first region and a second region. Through pores are formed in the first region. Pores that do not traverse the substrate are provided in the second region. The production of the work piece is performed with the aid of electrochemical etching of the pores. The entire surface of the substrate is covered with a mask layer that is structured photolithographically on the rear of the substrate. The bottoms of the pores in the second region are etched clear, preferably using KOH.

Perforated work piece, and method for producing it

Growing community of inventors

Dresden, Germany

Stefan Ottow