Epcos Ag

Tdk Electronics Ag

Stefan Obermair

Thomas Feichtinger

Franz Rinner

Michael Schossmann

Günter Engel

Manfred Schweinzger

Pavol Dudesek

Jürgen Konrad

Christian Block

Robert Hoffmann

Sebastian Brunner

Axel Pecina

Markus Koini

Bernhard Döllgast

Yongli Wang

Klaus-Dieter Aichholzer

Christian Faistauer

Gerhard Fuchs

Masahiro Oishi

Yasuharu Miyauchi

Andreas Egger

Stefan Köstner

Werner Tschnuchnig

A ceramic component and a method for manufacturing a ceramic component are disclosed. In an embodiment a ceramic component includes a ceramic base body and at least one metallization located an outer surface of the ceramic base body, wherein the metallization contains lithium vanadium phosphate having the general chemical formula LiV(PO), copper and glass, wherein a is a proportion of copper, b is a proportion of lithium vanadium phosphate and c is a proportion of glass which is contained in the metallization, wherein the following applies: 40 wt. %≤a≤99 wt. %, 1 wt. %≤b≤30 wt. %, 0 wt. %≤c≤20 wt. %, wherein x is a proportion of lithium, y is a proportion of vanadium and z is a proportion of phosphate in lithium vanadium phosphate, and wherein the following applies: 0<x, 0<y, 0<z.

Ceramic component and method for manufacturing the ceramic component

A method for producing a gas-tight metal-ceramic join is disclosed. In an embodiment a method includes providing at least one ceramic main body having a first end face and a second end face, applying a metallization to at least a partial region of the end faces of the main body, applying a nickel layer to the metallized partial region of the end faces, applying a brazing paste to the metallized partial region of the first end face and/or the second end face of the main body, drying the brazing paste, and firing the brazing paste.

Method for producing a gas-tight metal-ceramic join and use of the gas-tight metal-ceramic join

An overvoltage protection element and a method for producing an overvoltage protection element is disclosed. In an embodiment, the overvoltage protection element includes a first electrode, a second electrode and a discharge region arranged between the first electrode and the second electrode, wherein a porous discharge dielectric is arranged in the discharge region, and wherein the overvoltage protection element is configured to discharge a gas in pores of the discharge dielectric and produce an electrically conductive connection between the first electrode and the second electrode.

Overvoltage protection element and method for producing an overvoltage protection element

A chip and a method for manufacturing a chip are disclosed. In an embodiment, the chip includes a varistor layer composed of zinc oxide, a multilayered electrode structure which realizes a varistor function in the varistor layer and at least two solderable or bondable external contacts on a first main surface of the varistor layer. The chip further includes a glass layer disposed on the first main surface leaving only the external contacts uncovered, wherein the glass layer includes, as main constituents, oxides of Si and/or Ge, B and K, which in total have at least 70% by weight of the constituents of the glass layer, and wherein the glass layer is substantially free of Al, Ga, Cr and Ti.

Chip with protection function and method for producing same

An electrical component is disclosed. In an embodiment the component includes a component body and at least one connection element having a plastic body, wherein the at least one connection element is connected to the component body via a metal layer.

Electrical component comprising a connection element having a plastic body

A multi-layer capacitor has dielectric layers and electrode layers arranged therebetween. The multi-layer capacitor has a number of segments that are connected to one another. At least one relief region is provided between the segments. The invention furthermore provides a method for producing such a multi-layer capacitor.

Multi-layer capacitor and method for producing a multi-layer capacitor

Growing community of inventors

Stainz, Austria

Stefan Obermair