Massachusetts Institute of Technology

Stefan Nikles

Brian Lee Wardle

Mathew Varghese

Fabio Fachin

The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1&#xd7;, 5&#xd7;, 10&#xd7;, 100&#xd7; or 500&#xd7; the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.

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Cambridge, MA, United States of America

Stefan Nikles