Siemens Aktiengesellschaft

Rolls-royce Deutschland Ltd & Co. Kg

Siemens Energy Global Gmbh & Co. Kg

Stefan Nerreter

Martin Franke

Rüdiger Knofe

Bernd Müller

Peter Frühauf

Klaus Wilke

Jörg Strogies

Rene Blank

Ulrich Wittreich

Tobias Happel

Michael Niedermayer

Axel Beier

Matthias Heimann

Nora Jeske

Volker Türck

Andre Matthias Kwiatek

Dirk David Goldbeck

Grigorios Barboutis

Manfred Zäske

Carsten Borwieck

The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (), characterized by at least one separating element () formed in the wiring carrier plate (), which separating element divides the wiring carrier plate () into sections separated by the separating element (), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks () arranged on the wiring carrier plate (), and power semiconductors ().

Vibration-damped circuit arrangement, converter, and aircraft having such an arrangement

Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.

Semiconductor component and method for producing same

Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.

Electrical assembly

Various embodiments include an electro-optical circuit with an optical transmission path comprising: an electro-optical assembly having an optical transmitter element and/or an optical receiver element mounted on a mounting surface of a carrier component; a circuit carrier with a mounting side and an embedded optical waveguide exposed with an end face in a cutout in the mounting side; and an optical interface between the electro-optical assembly and the optical waveguide. The optical transmitter element and/or the optical receiver element is mounted on the carrier component with an alignment of its respective optical axis parallel to the mounting surface. The optical assembly is mounted on the circuit carrier with the mounting surface facing toward the mounting side. The optical transmitter element and/or the optical receiver element projects into the cutout and forms an optical axis with the exposed optical waveguide.

Electro-optical circuit comprising an optical transmission path, electro-optical assembly for installation in such an electro-optical circuit and method for producing an optical interface of an electro-optical circuit

Various embodiments may include an identification device comprising: a data memory storing a piece of information containing an identification; a processor generating a signal indicating the piece of information; an optical-to-electrical energy converter supplying power for the processor and converting electromagnetic radiation from the surroundings into an electric current feeding the processor via a power connection; an output device with a data connection to the processor for transmitting the signal; and an executable program stored in the processor for reading an input signal transmitted via the power connection and superimposed on the electrical current.

Electronic identification device

Examples include cooling members for electronic components and/or methods for producing cooling members. The members may include: an assembly side for an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels. The cooling channels may have a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.

Pourous heat sink with chimney

A display element and a display device in which the display element is mounted. The display may be a variable message sign. The sign includes a tube-like housing in which lenses and apertures can be disposed. The light exiting a light source is emitted via an emitting surface, by way of which an illuminated traffic sign results from interacting with further display elements. The light source and the optical elements are disposed at different heights in the horizontally oriented housing. The optical axes can thereby extend horizontally, or the optical elements can lie on a main axis which is tilted downward in an radiation direction. In both cases, sunlight impinging from above at an angle advantageously falls on the LED to a slight degree, by way of which the phantom light phenomenon is minimized.

Optical display element and display device

The embodiments relate to a sensor strip () and to a flexible support strip () for receiving the sensor strip and for fixing the strip to a surface e.g. to the back of a test person. According to the embodiments, the sensor strip () has a reference point (), (for example a snap fastener connection), with which it can be fixed to a reference surface () of the support strip. This allows the position of the sensor strip () to be unambiguously defined on the support strip (). The further extension of the sensor strip () lies in a pocket () so that it can slide, allowing the relative movement between the support strip and the sensor strip if the support strip is lengthened (represented by a dot-dash line). The entire sensor unit is thus advantageously more comfortable to wear, as the elastic support strip (), for example, can freely follow the back movements of the test person.

Support structure for a sensor strip and sensor strip for mounting on said support structure

A rotary transmitter for transmitting optical signals between two components is described. In accordance with the invention, provision is made for a fiber optic cable, optionally also a second fiber optic cable to be used to transmit the signals, the latter being suited, due to their surface treatment, to coupling signals of send elements and forwarding them to an interface in order to be registered there by a receive element. The fiber optic cables are laid such that they describe a circle upon which the transmission elements rotate about an axis of rotation. As a result, a complete data transmission is possible by way of the waveguide. The components (send elements, receive elements and the optical fiber cables) can be fastened to an annular printed circuit board by SMT.

Growing community of inventors

Heidesee OT Blossin, Germany

Stefan Nerreter