Sicoya Gmbh

Technische Unversität Berlin

Technische Universitaet Berlin

Deutschetelekom Ag

Ihp Gmbh - Innovations for High Performance Microelectronics

Ihp Gmbh-Innovations for High Performance Microelectronics/leibniz-Institut Fur Innovative Mikroelektronik

Stefan Meister

Hanjo Rhee

Christoph Theiss

Aws Al-Saadi

Sven Otte

Moritz Grehn

Lars Zimmermann

Thorsten Kettler

Sebastian Höll

Sebastian Kupijai

Hans Joachim Eichler

Thomas Schneider

Bernd Tillack

Marco Vitali

Ulrich Keil

Lei Yan

Chenhui Jiang

David Selicke

Marvin Henniges

Muhammad Atif

David Stolarek

Bulent Franke

Kambiz Jamshidi

Mischa Gehring

Andrea Zanzi

Sebastian H Ll

Bülent Franke

An exemplary embodiment of the present invention relates to an optical assembly comprising a laser module having a pluggable interface, an optical input-output module having a pluggable interface, and a base module having a first pluggable interface that is pluggably connected to the pluggable interface of the laser module, a second pluggable interface that is pluggably connected to the pluggable interface of the input-output module, and a transceiver optically located between the first and second pluggable interface of the base module.

Optical assembly

The invention relates to a switch system comprising one or more optical transceiver assemblies () connected to a switch ASIC ().

Assembly of network switch ASIC with optical transceivers

A photonic component having a photonically integrated chip and a fibre mounting, wherein the fibre mounting has: at least one groove, into which an optical fibre is placed, and at least one mirror surface, which reflects radiation from the fibre in the direction of the photonically integrated chip and/or reflects radiation from the photonically integrated chip in the direction of the fibre. A chip stack comprising at least two chips is arranged between the photonically integrated chip and the fibre mounting, the chip stack has at least two through holes and in each case a guide pin, which positions the chip stack and the fibre mounting relative to one another, passes through the at least two through holes of the chip stack.

Photonic component and method for production thereof

The invention relates to a photonic component () having at least one semiconductor laser amplifier (), which has at least one first mirror surface () for coupling and/or decoupling optical radiation (S). The first mirror surface () of the semiconductor laser amplifier () is coupled to a photonically integrated chip (), wherein the chip () is arranged such that the chip can emit optical radiation (S) from the chip top side (O) thereof in the direction of the first mirror surface () and couple said radiation in the semiconductor laser amplifier (), and wherein the emitting of the radiation (S) away from the chip top side (O) occurs in the direction of the first mirror surface () at an angle of 90&#xb0;&#xb1;20&#xb0;, in particular perpendicular, to the chip top side (O).

Photonic component

An optoelectronic device that includes at least one adjustable optical damping member arranged upstream of a photodetector and damps the optical radiation passing to the photodetector. The device is configured so that an electrical output of an amplifier is connected directly or indirectly to the adjustable optical damping member. An output signal of the amplifier or a control signal formed therewith drives the optical damping member, and the photodetector, the amplifier and the damping member are integrated in the same semiconductor substrate.

Optoelectronic component including a photodetector and an optical damping member to damp the optical radiation passing to the photodetector

The invention relates to a photonic component () having a photonically integrated chip () and a fibre mounting (), wherein the fibre mounting () has: at least one groove (), into which an optical fibre () is placed, and at least one mirror surface (), which reflects radiation (S) from the fibre () in the direction of the photonically integrated chip (). According to the invention a chip stack () comprising at least two chips is arranged between the photonically integrated chip () and the fibre mounting (), the chip stack () has at least two through holes () and in each case a guide pin (), which positions the chip stack () and the fibre mounting () relative to one another, passes through the at least two through holes () of the chip stack ().

An optoelectronic component includes a chip having a substrate and at least one optical waveguide integrated in the chip. The electro-optical component may be monolithically integrated in one or a plurality of semiconductor layers of the chip arranged on the substrate top side of the substrate, or on the substrate top side of the substrate. At least one electrical connection of the monolithically integrated electro-optical component is connected by means of a connection line to a conductor track connection situated below the substrate rear side. The connection line extends through a hole in the substrate from the electro-optical component to the conductor track connection situated below the substrate rear side.

Optoelectronic component

An optoelectronic component including an optical waveguide integrated into a plane of the component. The optical waveguide configured to guide optical radiation in the plane. The component including a coupling element connected to the waveguide and coupling optical radiation into the waveguide along the main coupling path. The degree of coupling efficiency of the coupling element is less than one in respect to the main coupling path. The coupling element outputs optical loss radiation along a secondary coupling path. The optical loss radiation is proportional to the radiation transferred along the main coupling path. The optoelectronic component includes a detector connected to the coupling element that registers the optical loss radiation and produces a detector signal. The optoelectronic component includes a control unit configured to influence at least one operating variable of the optoelectronic component based on the detector signal.

An embodiment of the invention relates to an optical signal generator comprising an optical emitter configured to generate a beam of optical radiation, a first and second beam deflecting element, a modulator being located between the beam deflecting elements, a phase shifter located between the beam deflecting elements, a control unit configured to control the phase-shift of the phase shifter, wherein the first and second beam deflecting elements, the phase shifter and the modulator are located in the same plane, wherein the beam generated by the optical emitter is angled relative to said plane, wherein said first beam deflecting element is configured to deflect the emitter's beam into the plane towards the modulator, said modulator being configured to modulate the emitter's radiation and outputting a modulated radiation, wherein said second beam deflecting element is configured to deflect the modulated radiation off the plane towards an output port of the signal generator, wherein the modulator is configured to modulate the emitter's radiation in response to an electrical data signal that is applied to the modulator and comprises a data stream, and wherein the control unit is configured to generate a control signal in order to control the phase-shift of the phase shifter and in order to avoid or reduce an impact of reflected radiation on the emitter's emission characteristic.

Optical signal generator comprising a phase shifter

A photonic component that includes a photonically integrated chip and a fiber holder that is mechanically connected to said chip. The fiber holder includes at least one groove with an optical fiber laid therein. The chip includes a substrate whose substrate base material is a semiconductor material, an integrated optical waveguide that is integrated into one or more material layers of the chip, which layers are wave guiding and positioned on the substrate, a coupler formed in the optical waveguide or connected to said optical waveguide, particularly a grating coupler, and an optical diffraction and refraction structure that is integrated into one or more material layers of the chip which are positioned above the optical coupler when viewed from the substrate, and that shapes the beam prior to its being coupled into the waveguide or after being coupled out of the waveguide.

Photonic component and method for producing same

An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.

An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.

Optoelectronic component having a resonator

An injection modulator for modulation of optical radiation, having an optical waveguide and a diode structure, having at least two p-doped semiconductor portions, at least two n-doped semiconductor portions and at least one lightly or undoped intermediate portion between the p-doped and n-doped portions. The p-doped portions when viewed in the longitudinal direction of the waveguide are offset with respect to the n-doped portions and the diode structure is arranged in a resonance-free portion of the waveguide. The p-doped portions lie on one side of the waveguide, the n-doped portions lie on the other side of the waveguide and the intermediate portion lies in the center, each portion extends transversely with respect to the waveguide longitudinal direction in the direction of the waveguide center of the waveguide and no p-doped portion when viewed in the longitudinal direction of the waveguide overlaps any n-doped portion.

Injection modulator

An electro-optic modulator for the modulation of optical radiation of a predetermined wavelength, the electro-optic modulator having at least one optical resonator in which a standing optical wave can be formed for the predetermined wavelength. In the resonator, at least two doped semiconductor sections&#x2014;as seen in the longitudinal direction of the resonator &#x2014;are arranged at a distance from one another, and the at least two doped semiconductor sections respectively lie locally at an intensity minimum of the standing optical wave.

Electro-optic modulator

An optical pulse delay generator is provided. The optical pulse delay generator includes a first optical converter which is dispersive and separates the spectral components of the incoming optical pulse in a time domain. The first optical converter generating a converted optical signal. The optical pulse delay generator also includes a modulator to modulate the converted optical signal and to generate a modulated optical signal and a second optical converter connected to the modulator. The second optical converter being dispersive for overlaying the previously separated spectral components in the time domain and generating the delayed optical output pulse. The dispersion imposed by the second optical converter has the same amount of dispersion, but the opposite sign, as the first optical converter. At least one of the first and second optical converter includes at least two waveguide resonator rings which differ in their optical length.

Growing community of inventors

Berlin, Germany

Stefan Meister