Suss Microtec Lithography Gmbh

Stefan Lutter

Gregory George

Rainer Targus

Ralph Beyer

A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.

Method and apparatus for temporary bonding of ultra thin wafers

By means of the device for coating a substrate () according to the present invention, a homogeneous coating of the substrate () can be achieved. The device comprises a holding and rotating means for holding and rotating the substrate () about an axis (A). A disk () is provided below the substrate (). Said disk () is arranged coaxially with respect to the substrate (), has at least the same diameter as the substrate () and is able to rotate synchronously with the substrate (). By means of the disk (), air swirls at the edge of and below the substrate () are avoided during coating of the substrate (). Thus, it is possible to obtain a homogeneous coating. For being able to load and unload a substrate () into and out of the device by means of a conventional gripper system (), the distance between substrate () and disk () is increased during loading and unloading.

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Eisingen, Germany

Stefan Lutter