Multitest Elektronische Systeme Gmbh

Multitest Elektronishche Systeme Gmbh

Multitest Elektronische Systems Gmbh

Stefan Kurz

Andreas Nagy

Bernhard Lorenz

Max Schaule

Thomas Hofmann

Helmut Scheibenzuber

Reinhart Richter

Maximilian Schaule

Manuel Petermann

Johann Pötzinger

Klaas Akkermann

Manfred Eibl

Andeas Nagy

A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

System for post-processsing of electronic components

A device for removing tested semiconductor components from a clamping carrier having fixed stop elements and movable clamping elements, pre-tensioned by spring elements includes an actuation device arranged above the clamping carrier, which moves the clamping elements into an opening position enabling the clamping carrier to be discharged, and then moves the clamping elements into a rest position after discharge, an intermediate carrier, positioned under the clamping carrier during discharge, onto which the clamping carrier is emptied, a data memory in which data about each semiconductor component are stored, and a removal device, which removes the semiconductor components from the intermediate carrier and sorts them into at least two different categories in accordance with the data stored in the data memory.

Device and method for removing tested semiconductor components

System for post-processing of electronic components

A closure mechanism for pressure test chambers for testing electronic components, in particular ICs, has a plurality of pivoting jaws. At least some of the pivoting jaws have at least one lifting apparatus which can be advanced to two interacting cavity elements, which surround a cavity, by means of the pivoting jaws. Furthermore, at least some of the pivoting jaws have at least one locking device in order to move spacer elements into an intermediate space between the associated pivoting jaws and the compressed cavity element, as a result of which the tightness of the cavity is maintained even when the lifting apparatuses are retracted.

Closure mechanism for pressure test chambers for testing electronic components, in particular ICs

In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device, to which the contacting board can be fastened, is mounted on the test head. The contacting board supporting device can be moved parallel to the plane of the contacting board when the contacting nest is docked on the test head, with the result that the contacting board can be brought into different test positions which are laterally beside one another.

Test apparatus for the testing of electronic components

A device for testing electronic components such as integrated circuit ICs, under particular pressure conditions, has a pressure test chamber with contact elements which on the one hand are connected to an electronic testing device and on the other hand extend into a cavity of the pressure test chamber. Arranged inside the cavity of the pressure test chamber, there is and air-fight sealing board which extends transversely over the contact elements and is sealed peripherally from an assigned pressure chamber half. By means of the sealing board, first contact element sections are separated air-tightly from second contact element sections but are in electrically conductive connection.

Device for testing electronic components, in particular ICs, having a sealing board arranged inside a pressure test chamber

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Rosenheim, Germany

Stefan Kurz