Siemens Aktiengesellschaft

Stefan Kulig

Michael Kirchberger

Kurt Gross

Hans Rappl

Volker Karrer

Gerd Auerswald

Gunter Ludwig

The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.

Circuit arrangement

A plastic frame ( ) serves for the simple mounting of an electronic heavy-current control unit. It has cutouts ( ) for the positionally accurate receiving of busbars ( ), metal plates ( ) and electrical/electronic components ( to ) and also the potting compound ( ) thereof and is provided with integrally formed snap-action elements ( ) for connection to a heat sink ( ).

Plastic frame for the mounting of an electronic heavy-current control unit

A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least two metallic plates insulated electrically from one another by an insulating layer that preferably conducts heat well and has holes for the connecting pins of the electric and/or electronic components. Through which holes the connecting pins are plugged and connected electrically to the respectively associated metallic plate.

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Wuppertal, Germany

Stefan Kulig