Atotech Deutschland Gmbh

Wolfgang Dahms

Heinrich Meyer

Stefan Kretschmer

Mentor Gmbh & Co. Präzisions-bauteile Kg

Philipp Wachter

Christina Pfirrmann

Philip Hartmann

Gonzalo Urrutia Desmaison

Bernd Roelfs

Gerd Senge

Thorsten Ross

Torsten Küssner

Benjamin Mohr

Thomas Kümpfel

Hans-Walter Wilms

Uwe Gräbel

Aqueous acidic copper electroplating bath comprising: copper ions; at least one acid; halide ions; at least one sulfur containing compound selected form the group consisting of sodium 3-mercaptopropylsulfonate, bis(sodiumsulfopropyl)disulfide, 3-(N,N-dimethylthiocarbamoyl)-thiopropanesulfonic acid or the respective sodium salt thereof and mixtures of the aforementioned; at least one amine reaction product of diethylamine with epichlorohydrin or an amine reaction product of isobutyl amine with epichlorohydrin or mixtures of these reaction products; at least one ethylene diamine compound selected from the group having attached EO-PO-block polymers, attached EO-PO-block polymers and sulfosuccinate groups and mixtures thereof; at least one aromatic reaction product of benzylchloride with at least one polyalkylenimine and a method for electrolytically depositing of a copper coating using the electroplating bath.

Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating

The present invention relates to a plating composition for electrolytic copper deposition, comprising copper ions, halide ions and at least one acid, at least one benzothiazole compound, at least one phenazine dye and at least one ethanediamine derivative. The present invention further concerns the use of above plating composition and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate.

Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate

The present invention concerns a method for cathodic corrosion protection of a substrate having a chromium surface and at least one intermediate layer between the substrate and the chromium surface, selected from the group comprising nickel, nickel alloys, copper and copper alloys and wherein said chromium surface is contacted with an aqueous solution comprising at least one compound containing phosphorous while passing an electrical current through said substrate, at least one anode and the aqueous solution wherein said substrate serves as the cathode.

Method for cathodic corrosion protection of chromium surfaces

In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3-epoxy-1-propanol) and derivatives thereof.

Copper bath and methods of depositing a matt copper coating

Process for the electrolytic deposition of metal layers

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Berlin, Germany

Stefan Kretschmer