Micronas Gmbh

Stefan Kredler

Reiner Bidenbach

Jens Schubert

Klaus Heberle

Ralf Janke

A semiconductor component has at least one semiconductor chip in which an electrical circuit is integrated. The semiconductor chip is surrounded by an electrically insulating encapsulating compound and has on its surface at least one termination surface for a test signal, which is covered by the encapsulating compound. The termination surface is connected in an electrically conductive manner to an analysis contact that projects above the surface of the semiconductor chip, that is located in the interior of the encapsulating compound at a distance from its exterior surface, and that can be exposed by removing a layer of the encapsulating compound located near the exterior.

Semiconductor component

A method for testing a Hall magnetic field sensor on a wafer includes generating a current flow in a Hall plate of the Hall magnetic field sensor. At least one voltage value across first and second nodes is measured and a measured voltage signal is provided indicative thereof. An electrical resistance based upon the measured voltage and the current is then determined, in the absence of an applied test magnet field.

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Heuweiler, Germany

Stefan Kredler