Marconi Communications Gmbh

Sciosense B.v.

Ericsson Ab

Stefan Kern

Gregor Gerhard

Stefan Koch

Willibald Konrath

Martin Schallner

Klaus Junger

Torben Weng

Faik Coskunsu

Marco Trautwein

In an embodiment an ultrasonic flow meter includes a first transducer and a second transducer, a first impedance circuit and a second impedance circuit, each of the first and second impedance circuits having a variable impedance, a first terminal coupled to the first transducer via the first impedance circuit, a second terminal coupled to the second transducer via the second impedance circuit, a signal generator with a signal output and a signal evaluation circuit with a signal input, wherein the signal output and the signal input are coupled to the first and second terminals, and wherein the signal evaluation circuit includes a time-to-digital converter and a first comparator that couples the signal input to a first input of the time-to-digital converter, and a control circuit that is coupled to the signal generator, the signal evaluation circuit and the variable impedance.

Ultrasonic flow meter and method for ultrasonic flow metering

A charge pump structure is disclosed. In an embodiment a regulated charge pump structure includes an output terminal configured to provide a regulated output voltage, a first charge pump configured to generate the output voltage as a function of an input supply voltage and a control circuit configured to limit a level of the output voltage and to generate a control voltage, wherein the level of the output voltage is controlled by the control voltage such that the output voltage does not exceed a threshold value.

Charge pump structure with regulated output voltage

A millimetric-wave amplifier arrangement comprises a first amplifier whose output is connected to one input of the second amplifier via an adjustable attenuator. Both amplifiers are integrated on a single substrate.

Integrated amplifier arrangement

An integrated semiconductor mixer includes a substrate (), a radio-frequency balun () disposed on the substrate (), a local oscillator balun () disposed on the substrate (), an intermediate-frequency port () disposed on the substrate (), and a mixer diode array (), disposed on the substrate (), that communicates with the radio-frequency balun (), the local oscillator balun (), and the intermediate-frequency port (), in which the radio-frequency balun () is shielded from the local oscillator balun () by plated holes ().

Integrated semiconductor mixer

A capacitor element on a chip, e.g., a MMIC chip, includes a main capacitor in parallel with a series configuration of trimming capacitors. The total capacitance value of the parallel arrangement can be increased from its inherently minimum value by applying one or more laser pulses to one or more of the trimming capacitors, such that in each case a short-circuit is produced between the metallization layer to which the pulses are applied and the other metallization layer making up the trimming capacitor.

Capacitor element and method for trimming a capacitor element

A monolithically integrated microwave guide component for overcoupling high frequencies includes a first micro-waveguide that is structured on a micro-waveguide chip, and comprises a second micro-waveguide that is structured on a carrier substrate. The microwave guides are contacted to one another by a chip through-plating. The microwave guides each include, in the contact region, an integrated compensating structure that serves to compensate for reflections.

Monolithically integrated microwave guide component for radio frequency overcoupling

A balancing network has three planar lines which are coupled together. One end of the first line which runs between the second and the third line acts as an unbalanced gate. The opposite end of the first line is connected to earth, and one end of each of the other two lines forms a balanced gate. The balancing network is decoupled from the direct current source. The ends of the second and third lines, which do not act as gates, are capacitively coupled with one another.

Balancing network

On a circuit-board intended for constant-wire-length (CWL) bonding, one or more special &ldquo;test&rdquo; pairs of bonding pads are provided along with, in each case, a series of markings adjacent the pads. In use, the board is populated with CWL bonds (this includes the normal circuit-related RF bond-pads as well as the test bond-pads) and the test bonds are distorted so that the bond-wires in question lie aligned against the markings. The alignment position relative to the markings indicates whether the bond-wires for the whole board are of correct or incorrect length. Measurement may be either absolute, in which case the markings are associated with a scale indication, or relative, in which case one of the markings will usually be visibly distinguished from the rest in some way. Depending on the length determination, the bond-forming device (e.g., ball and wedge) is adjusted so as to reduce any difference between the indicated length and the desired length when the next board is populated or when the next multi-board production run takes place.

Growing community of inventors

Waghausel, Germany

Stefan Kern