Abb Schweiz Ag

Sulzer Innotec Ag

Komax Holding Ag

Stefan Kaufmann

Albert Maria Vodermayer

Jens K&auml;rger

Hans Erlach

Thomas Lang

Egon Herr

Jérôme Assal

Mauro Nicola

Soto Gekenidis

Peter Morf

Adolf Hofer

The invention relates to a power semiconductor module having at least one semiconductor chip () made of a semiconductor material and having a first and a second main electrode (), a first and a second main connection () and a contact lamina () in electrical contact with the first main electrode () and the first main connection (). The contact lamina () contains an alloying partner which can form a eutectic with the semiconductor material. According to the invention, the contact lamina is coated with an electrically conductive protective layer () that prevents formation of a fixed material connection between the first main electrode () and the contact lamina ().

Functional coating of the SCFM preform

The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.

High power semiconductor module

The power semiconductor includes a module housing having a conductive cover plate and a conductive baseplate and also an insulating housing wall arranged between the cover plate and the baseplate. A power semiconductor circuit is accommodated in the module housing. Two terminals of the power semiconductor circuit are led out of the module housing, a first of the at least two terminals being provided for the contact connection of the cover plate. The two terminals are arranged on opposite areas of a printed circuit board led out of the module housing, which printed circuit board can be contact-connected by means of a standard connector. The power semiconductor module according to the invention has improved contacts with regard to stability and inductance.

Contact system

A cooling device for a high-power semiconductor module has a cooler lower part ( ) and a cooler upper part ( ), with the cooler upper part ( ) being connected to the cooler lower part ( ) by an integral material connection. The cooler upper part ( ) has a cooling plate ( ) composed of metal matrix composite, for at least one semiconductor component ( ) to be fitted to. A metal border ( ) is integrally formed on the cooling plate ( ) in order to allow an integral material connection between the cooler upper part ( ) and the cooler lower part ( ). This results in a cooling device which can be produced easily and whose cost is low.

Cooling device for a high-power semiconductor module

The method for the manufacture of unidirectionally fiber reinforced thermoplastic bands comprises a pressure impregnation of a fiber strand in a bath with a dispersion of thermoplastic particles. Heat treatments for the drying of the strand and a melting on of the particles taken up by the strand follow the pressure impregnation. The strand is drawn through the bath at a predetermined draw-off speed about a plurality of deflection elements. The dispersion of the bath is largely held in a stationary state, namely through the supply of an infeed dispersion with a first particle concentration and through an initial setting of a second particle concentration in the bath: The infeed dispersion is fed in continuously or periodically, with the first particle concentration being held constant. A corresponding feeding in of a dispersion of higher particle concentrations as well as an additional amount of dispersing medium is possible. The second particle concentration is set to a value which remains constant through an automatic self-setting alone. In this the two named concentrations depend in an empirically determinable manner on a thermoplastic content of the band to be achieved and on the draw-off speed.

Growing community of inventors

Aarau, Switzerland

Stefan Kaufmann