Simage Oy

Siemens Aktiengesellschaft

Stefan Jurthe

Konstantinos E Spartiotis

Markku Eräluoto

Jouni Pyythi&auml;

Konstantinos Evangelos c/o Eip Spartiotis

Markku Tapio c/o Eip Eraluoto

An imaging device () for scan-imaging radiation includes an imaging cell array () comprising an array of detector cells generating charge in response to incident radiation () and an array of pixel circuits each pixel circuit associated with a respective detector cell. The pixel circuit includes circuitry for accumulating plural radiation hit on an associated detector cell and transfer circuitry shifting upon command the accumulated value of all pixels by one step in one dimension (e.g., row by row). The imaged object () moves at a speed V() with respect to the radiation source and the imaging detector (or source and detector move at &#x2212;Vwith respect to the object) on which the accumulated values are shifted are with V(). Vmay equal Vin value and direction. Thus, a value is accumulated in a moving information package using multiple pixels () and referring directly to a location on the moving object. The accumulated values are read out along one edge of the pixel array. An image is reconstructed in () and displayed in ().

Imaging device

A semiconductor radiation imaging assembly comprises a semiconductor imaging device including at least one image element detector. The imaging device is arranged to receive a bias for forming the at least one image element detector. The assembly also includes bias monitoring means for monitoring the bias for determining radiation incident on the image element detector. Preferably, the imaging device comprises a plurality of image element detectors the bias for at least some of which is monitored for determining incident radiation. More preferably, the bias for all the detector elements is monitored.

Self triggered imaging device for imaging radiation

A radiation imaging assembly includes a radiation imaging detector (160) including a plurality of image elements from which respective signals may be produced and a plurality of contacts for outputting said signals. A first substrate (154) is provided which comprises first and second major surfaces, said first major surface supporting said radiation imaging detector and providing support contacts for cooperating with respective contacts of said radiation imaging detector when mounted on said first surface. A second substrate for supporting electronic circuitry operable for said imaging device tile is also provided, said second substrate (158) disposed opposing said first substrate, and preferably disposed within the footprint of the first substrate.

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Espoo, Finland

Stefan Jurthe