Thintronics, Inc.

Aditya Birla Chemicals (usa) LLC

Connora Technologies, Inc.

University of California

Adesso Advanced Materials Wuhu Co., Ltd.

Stefan J Pastine

Szymon Kosinski

Tarun Amla

Bo Liang

Bing Qin

Alexander K Zettl

David C Okawa

Jean M J Frechet

Xin Li

Ulhas Bhatt

Yaroslav Klichko

A curable film and a cured product obtained by curing the curable film are disclosed. The curable film contains, as essential components, hollow glass microspheres and a rubber composition containing at least one diene-based rubber. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.

Curable film composition, curable film, and cured product thereof

A composition for curable films, a curable film made thereof, and a cured product obtained by curing the curable film are disclosed. The curable film contains fused silica and/or hollow glass microspheres, a rubber composition containing at least one diene-based rubber, and a toluene soluble maleimide resin. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.

Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.

Materials for printed circuit boards

This application relates, in part, to novel salts represented by the following structure of Formula (1): wherein Ris selected from the group consisting of hydrogen and optionally substituted alkyl (e.g., unsubstituted Calkyl, e.g., —CH); Ris optionally substituted alkyl (e.g., unsubstituted Calkyl, e.g., —CH); each occurrence of Rand Ris independently selected from the group consisting of hydrogen, optionally substituted alkyl, optionally substituted cycloalkyl, and optionally substituted aryl; Rand Rcan combine with each other to form optionally substituted cycloalkyl; each m and n is independently an integer ranging from 1 to 20 (e.g., m and n is independently an integer ranging from 1 to 5); and each of Qand Qis independently a counterion (e.g., each of Qand Qis independently a counterion selected from the group consisting of chloride, bromide, fluoride, iodide, acetate, carboxylate, hydrogen sulfate, nitrate, and phenolate, and sulfonate, e.g., chloride), and methods of making the same.

Salts of diaminoacetals and diaminoketals and their synthesis, and their transformations to diaminoacetals and diaminoketals

Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.

Polymer compositions and their uses

Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

Silicon-containing compositions and their methods of use

The present invention relates to the reduction of polycyano compounds to produce polyamines, in particular diaminoacetal and diaminoketal compounds, and their use as curing agents in epoxy resin compositions. The reduction with molecular hydrogen can be carried out using a metal catalyst selected from GROUP VIII and a catalytic promoter. The reduction can include anhydrous or aqueous ammonia. The reaction can be carried out in continuous and batch modes with catalyst and solvent recycling. The epoxy resin composition consisting of an epoxy resin and a polyamine curing agent that can be used in fiber-reinforced composite materials, coating materials, and the like.

Synthesis of and compositions containing diaminoacetals and diaminoketals

This application relates, in part, to novel salts represented by the following structure of Formula (1): wherein Ris selected from the group consisting of hydrogen and optionally substituted alkyl (e.g., unsubstituted Calkyl, e.g., &#x2014;CH); Ris optionally substituted alkyl (e.g., unsubstituted Calkyl, e.g., &#x2014;CH); each occurrence of Rand Ris independently selected from the group consisting of hydrogen, optionally substituted alkyl, optionally substituted cycloalkyl, and optionally substituted aryl; Rand Rcan combine with each other to form optionally substituted cycloalkyl; each m and n is independently an integer ranging from 1 to 20 (e.g., m and n is independently an integer ranging from 1 to 5); and each of Qand Qis independently a counterion (e.g., each of Qand Qis independently a counterion selected from the group consisting of chloride, bromide, fluoride, iodide, acetate, carboxylate, hydrogen sulfate, nitrate, and phenolate, and sulfonate, e.g., chloride), and methods of making the same.

The present invention relates to methods for recycling reinforced composites. The reinforced composite comprises a reinforcement material in a cross-linked polymer matrix, wherein the cross-linked polymer comprises a cross-linking group derived from a curing agent represented by formula I, wherein Ris hydrogen, alkyl, cylcoalkyl, heterocycloalkyl, alkenyl, cycloalkenyl, aryl, heteroaryl, alkoxy alkyl or alkynyl; A is alkyl, alkenyl, alkenene, alkylene-hetero-alkylene, alkylene-heterocyclo-alkylene, alkylene, alkylene-oxy-alkylene, 1,4-alkyl substituted piperazine, carbonyl, thiocarbonyl; B is alkyl, alkenyl, alkenene, alkylene-hetero-alkylene, alkylene-heterocyclo-alkylene, alkylene, alkylene-oxy-alkylene, 1,4-alkyl substituted piperazine, carbonyl, thiocarbonyl; Ris hydrogen, alkyl, aminoalkyl, alkyl-amino-alkyl, cylcoalkyl, heterocycloalkyl, alkenyl, aryl, or heteroaryl; and Ris hydrogen, alkyl, aminoalkyl, alkyl-amino-alkyl, cylcoalkyl, heterocycloalkyl, alkenyl, aryl, or heteroaryl. 

Methods for recycling reinforced composites

The present disclosure relates, in part, to an epoxy resin composition comprising: an epoxy resin; and an aliphatic polyamine (e.g., as a cross-linking agent), wherein the aliphatic polyamine comprises a compound having the structure of Formula (1): wherein each of R1 and R2 is independently selected from the group consisting of hydrogen, alkyl group, cycloalkyl group and aromatic group; or R1 and R2 together with the carbon atom to which they are attached form a cyclic ring; each of R3 and R4 is independently selected from the group consisting of hydrogen, alkyl group, cycloalkyl group and aromatic group. 

Sterically hindered aliphatic polyamine cross-linking agents, compositions containing them and uses thereof

Compounds of formula I, uses as crosslinking agents or curing agents thereof, and resins obtained by using the compounds as crosslinking agents.

Growing community of inventors

San Francisco, CA, United States of America

Stefan J Pastine