Berliner Glas Kgaa Herbert Kubatz Gmbh & Co.

Berliner Glas Gmbh

Stefan Hoescheler

Ralf Hammer

Carsten Pampuch

David Kieven

Mike Fischer

Gregor Hasper

Marcel Ziemann

A holding apparatus, which is adapted for electrostatically holding a component, in particular a wafer, comprises an electrically insulating base body, which comprises a first pair of base body plates, which are connected to one another in a planar manner via a joint connection, and an electrode device with at least one electrode layer, which is arranged to generate an electrostatic holding force and extends parallel to the extension of the base body plates along the joining connection, wherein the joining connection comprises a diffusion bond connection, wherein the at least one electrode layer is connected in a planar manner to the respectively adjacent base body plate, and the at least one electrode layer has a contact section, which is arranged for electrically contacting the at least one electrode layer. Methods for manufacturing the holding apparatus are also described.

Holding apparatus for electrostatically holding a component, including a base body joined by diffusion bonding, and process for its manufacture

Method of manufacturing holding plate () including ceramic material of several chemical elements and configured for holding apparatus () for holding a component by electrostatic forces or vacuum, includes the steps of material removal from holding plate () by laser ablation, wherein by laser irradiation () protrusions () are formed on holding plate (), end faces () of which span a carrier surface for the component, and surface modification of holding plate () by laser irradiation (), wherein irradiation parameters of laser irradiation () are set such that at least one of the chemical elements of the ceramic material is enriched on the surface of holding plate (). A method is also described of manufacturing holding apparatus () for holding a component by electrostatic forces or vacuum, holding plate () which is produced with the inventive method, and holding apparatus () with at least one holding plate ().

Method of manufacturing a holding plate, in particular for a clamp for holding wafers

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Berlin, Germany

Stefan Hoescheler