Orbotech Limited

Laser Imaging Systems Gmbh & Co. Kg

Jenoptik Optical Systems Gmbh

Laser Imaging Systems Gmbh

Jenoptik Aktiengesellschaft

Stefan Heinemann

Abraham Gross

Holger Wagner

Jonas Burghoff

Wolfgang Retschke

Thomas Dressler

Ullrich Krueger

Dirk Lorenzen

Steffen Ruecker

Friedhelm Dorsch

Franz Daiminger

Werner Eschke

Rainer Dohle

Christian Schwarz

Frank Jugel

Steffen Rücker

Ullrich KRÜGER

The invention is directed to a device for exposure control in photolithographic direct exposure processes for two-dimensional structures in photosensitive coatings and to a method for converting registration data into direct exposure data. The object of the invention, to find an improved exposure control in direct exposure methods for two-dimensional structures in photosensitive layers which permits a registration of target marks independent from defined locations of the target marks, is met according to the invention in that a plurality of entocentric cameras are arranged in a registration unit () in linear alignment transverse to the one-dimensional movement of the substrate () to form a gapless linear scanning area () over a predetermined width of the substrate (). The angles of view of adjacent entocentric cameras have an overlapping region along the linear scanning area () in which redundant image captures of the substrate () of the adjacent cameras () are detectable, and the computing unit () has means for calculating the position of the target marks from the redundant image captures of the adjacent entocentric cameras additionally using a height position of the target marks which is determined by triangulation of a distance of the substrate surface ().

Exposure control in photolithographic direct exposure methods for manufacturing circuit boards or circuits

A method of manufacture of objects including receiving a CAD file containing electrical circuit design data for direct writing on a surface, the CAD file including CAD data for a multiplicity of objects to be produced on the surface, automatically configuring a direct write machine to direct write direct writing data based on the CAD data on the surface in plural scans, each having a scan width less than a width of the surface, including arranging the direct writing data for the multiplicity of objects to be written in a side by side manner in each of the plural scans so as to be within the scan width, whereby stitching of direct writing data between adjacent scans is obviated and operating the direct write machine to create the multiplicity of objects on the surface.

Stitchless direct imaging for high resolution electronic patterning

A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.

System and method for direct imaging

A scanning device includes a scan unit with a polygon mirror, pre-scan optics and post-scan optics. The pre-scan optics are arranged upstream of the polygon mirror in such a way that a beam bundle coming from the light source impinges on the polygon mirror at an angle of incidence (&#x3b1;) in a cross scan plane, and the optical axis of the post-scan optics is arranged in a reflection direction of the polygon mirror. Distortions, trapezoidal distortion and scan bow, occurring when imaging the light source on a scan line are minimized in that the cylindrical mirror of the post-scan optics is tilted at a first tilt angle (&#x3b2;) relative to the surface normals to the polygon mirror in the cross scan plane, and one of the two corrective lenses of the post-scan optics is tilted relative to the optical axis of the post-scan optics at a second tilt angle (&#x3b3;) and is arranged so as to be offset by a distance.

Scanning device

An achromatic scanner in which pre-scan optics and post-scan optics are designed and disposed with respect to one another in such a way that for a light beam imaged onto the target surface a first image plane of the pre-scan optics coincides with a first object plane of the post-scan optics for a first beam portion and a second image plane of the pre-scan optics coincides with a second object plane of the post-scan optics for a second beam portion, wherein an image plane of the post-scan optics which lies on the target surface is associated with the first object plane of the post-scan optics and the second object plane of the post-scan optics.

Achromatic scanner having a monochromatic f-theta objective

A high-power diode laser and a method for mounting same are described. Predetermined breaking locations in the laser bar are provided which, during cooling after the laser bar has been soldered to a heat sink having a smaller thermal expansion coefficient, lead to breakage at defined locations between the single laser diodes of the laser bar. As a result of the physical division of the laser bar, it is possible to use a solder which has low ductility (hard solder) at room temperature, since destruction of the single laser diodes of the laser bar as a result of mechanical stresses can be ruled out.

High-power diode laser and method for mounting the same

Growing community of inventors

Jena, Germany

Stefan Heinemann