Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Stefan Gruber

Georg Bogner

Berthold Hahn

Siegfried Herrmann

Jörg Erich Sorg

Joerg Sorg

Herbert Brunner

Michael Zitzlsperger

Michael Wittmann

Thomas Zeiler

Markus Kirsch

Matthias Kiessling

Stefan Grötsch

Karl Weidner

Walter Wegleiter

Reiner Windisch

Stefan Groetsch

Julius Muschaweck

Karlheinz Arndt

Bernd Barchmann

Daniel Richter

Axel Kaltenbacher

Johann Ramchen

Sven Weber-Rabsilber

Torsten Baade

Markus Schneider

Steffen Köhler

Christian Ziereis

Andreas Gruendl

Huey Ling Rena Lim

Jörg Sorg

An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

Optoelectronic semiconductor component

An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.

Electronic component, leadframe, and method for producing an electronic component

In at least one embodiment of the optoelectronic semiconductor component (), the optoelectronic semiconductor component has a support (). At least one optoelectronic semiconductor chip () with a radiation outlet face () is applied onto a support upper face (). A sacrificial layer () is located over the radiation outlet face () in the direction away from the support (). A housing body () which has a housing upper face () is molded around the semiconductor chip () and/or around the sacrificial layer () in a lateral direction parallel to the radiation outlet face (). A sacrificial layer () upper face () which faces away from the radiation outlet face () is free of a housing body () material.

Optoelectronic semiconductor component and method for producing such an optoelectronic semiconductor component

A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.

Radiation-emitting component and method for producing radiation-emitting components

A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.

Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing

An arrangement having at least one optoelectronic semiconductor component includes a carrier element suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body formed from a light-absorbing plastic. The housing body is arranged at the carrier element The housing body comprises an elevated region and a recessed region. An oblique flank is formed between the elevated and recessed regions. The recessed region reaches as far as the optoelectronic semiconductor component in order to reduce reflections.

Arrangement comprising at least one optoelectronics semiconductor component

An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.

Optoelectronic module and method of producing an optoelectronic module

A semiconductor based component with radiation-emitting properties. A glass substrate () is provided, which has a first surface () and a second surface (), where a semiconductor element () with radiation-emitting properties is accommodated on the first surface (). Also disclosed is a method for fabricating a semiconductor based component, with the following steps: providing a glass substrate (), application of a semiconductor element () to the first surface () of the glass substrate. Also disclosed is a receptacle for a semiconductor based component in which two electrical contact areas () are provided, which can be electrically connected to contact areas () of the semiconductor based component.

Semiconductor based component, receptacle for a semiconductor based component, and method for producing a semiconductor based component

A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side and which are fixed by their rear side&#x2014;opposite the front side&#x2014;on a first main face of a common carrier body, wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.

Light-emitting diode arrangement and method for producing the same

A luminous unit () for an optical recording device () comprising a light source () for generating radiation and a partly reflective element, which is disposed downstream of the light source () in a main emission direction (H) and subdivides a space into a first half-space facing the light source () and a second half-space remote from the light source (), wherein the partly reflective element at least partly transmits the radiation coming from the light source () from the first half-space and at least partly reflects the external radiation coming from an opposite direction from the second half-space.

Illumination unit

A light-emitting surface element includes a connection device, a light-generating element having at least two electrical connections electrically conductively connected to assigned connection lines on the connection device, and at least one planar light-guiding element formed by injection-molding in a manner at least partly embedding an arrangement composed of connection device and light-generating element in the planar light-guiding element.

Light-emitting surface element and method for producing a light-emitting surface element

According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

Semiconductor arrangement

An arrangement includes a semiconductor chip, which is designed to emit light during operation, and a cover layer, which lies across from the light-emitting surface of the semiconductor chip, such that light emitted from the semiconductor chip penetrates into the cover layer. In an area of the cover layer, overlapping with the chip, a light deflecting structure is provided by means of which light penetrating into the cover layer is deflected. The cover layer acts as an optical waveguide and is designed to emit the light such that it is distributed over the upper surface of cover layer.

Arrangement with a semiconductor chip and an optical waveguide layer

An illumination unit comprising a luminescence diode chip mounted on a chip carrier and comprising an optical waveguide is specified. The optical waveguide is joined together from at least two separate parts, wherein the luminescence diode chip is encapsulated by one of the parts of the optical waveguide. A method for producing a luminescence diode chip of this type and also an LCD display comprising an illumination unit of this type are furthermore specified.

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Bad Abbach, Germany

Stefan Gruber