Infineon Technologies Ag

Osram Opto Semi-conductors Gmbh Co. Ohg

Stefan Gr&ouml;tsch

Georg Bogner

Hans-Ludwig Althaus

Bruno Acklin

Werner Sp&auml;th

A method for producing semiconductor laser components in which, a number of chip mounting areas are formed on a cooling element having an electrically insulating carrier that is in the form of a plate. A number of semiconductor laser chips are then fit to the cooling element, with one semiconductor laser chip being arranged on each chip mounting area. Finally, the cooling element, with the semiconductor bodies fit on it, is subdivided into a number of semiconductor laser components.

Method for producing semiconductor laser components

An apparatus for producing a chip-substrate connection, in particular by soldering a semiconductor chip on a substrate. The apparatus has a support, on which the substrate is temporarily supported, and a heating device which is provided for forming the chip-substrate connection. The heating device has a radiation source in the form of a laser in the infrared wavelength range. The support is formed by a heat body, which is assigned to the chip-substrate connection and is heated with thermal radiation by the radiation source. A surface of the heat body is coated with a material, in particular a material containing chromium, exhibiting high absorption with respect to the light radiation emitted by the radiation source.

Growing community of inventors

Wuppertal, Germany

Stefan Grötsch

Growing community of inventors

Wuppertal, Germany

Stefan Gr&ouml;tsch

Stefan Grötsch