Infineon Technologies Ag

Siemens Aktiengesellschaft

Stefan Geyer

Michael Horn

R&uuml;diger Hunger

Kathrin Kurth

Andreas Fischer

Ralf Gothel

An embodiment of the present invention is a transport and storage system for a slurry comprising: a main container; and a test container, the main container and the test container being exposed to the same environmental conditions, the main container and the test container containing a slurry from the same batch, wherein the test container is designed to determine the viscosity of the slurry.

Slurry transport and storage system

The present invention relates to an exposure mask for structuring a photoresist layer on a substrate wafer, in which an inorganic adhesive is used as an adhesive device for connecting a reticle having a lithographic structure, a frame and a pellicle. For chemical reasons, an adhesive of this type has no tendency or a considerably lower tendency to gassing out than an organic adhesive used in conventional exposure masks, so that the risk of particles which are deposited on the lithographic structure and which can cause projection errors during an exposure process is largely ruled out. The invention relates further to a method of producing such an inorganic adhesive and also a method of producing an exposure mask with the aid of such an inorganic adhesive.

Gassing-free exposure mask

The invention relates to a wafer level package for chips with chip edge protection, comprising individual chips, which can in each case be mounted on a suitable carrier board, and to a method for producing such a wafer level package. Aspects of the invention can be achieved by the chip being thinned extremely from the back side and bonded onto a fiber reinforced synthetic resin sheet, forming a solidly bonded assembly that cannot come apart in the customary temperature range, and the edges of the assembly being at least partly coated with a polymer.

Wafer level packages for chips with sawn edge protection

An abrasive pad is suitable for the wet-chemical grinding of a substrate surface. The novel abrasive pad has a polymer matrix with a defined water-solubility. The water-solubility is realized by the level of nonpolar and polar repeat units in the polymers.

Abrasive pad and process for the wet-chemical grinding of a substrate surface

A valve for a slurry outlet opening in an installation for chemical mechanical polishing, in particular of semiconductor wafers in DRAM production, includes an elastic diaphragm, which covers the slurry outlet opening and has at least one self-closing opening. It is possible for the opening to be moved into a feedthrough position for the slurry by flowing slurry and to be automatically moved into a blocking position for the slurry when the slurry is not flowing. A CMP installation having such a valve is also provided. This creates a simple way of preventing particle agglomerations in the region of the fluid outlet opening of a CMP installation.

Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve

A solution of tetramethylammonium hydroxide in water comprises a surfactant component and a hydrotropic component. A process for preparing a solution for developing an exposed photoresist comprises the steps: preparation of a solution of tetramethylammonium hydroxide in water; addition of a surfactant component; and addition of a hydrotropic component.

Solution of tetramethylammonium hydroxide in water and a process for preparing the solution

A scanning device for semiconductor wafers with which rapid and dependable scanning is permitted. The invention is characterized by a base plate with a guiding pin protruding from it for the manual guidance of a depositing plate which is displaceable on the latter. The depositing plate is intended to receive a semiconductor wafer and is provided on an underside with meandering guiding channels for guiding by the guiding pin. A liquid drop is kept on a surface of the semiconductor wafer by a scanning tube and collects metal and dopant traces from the semiconductor wafer. The liquid drop can then be analyzed for determining a purity of the surface of the semiconductor wafer.

Scanning device

A calibrating wafer and a method for the production of a calibrating wafer having polymer microspheres. The polymer microspheres are subjected to a heat treatment in a temperature range in which the polymer microspheres start to soften.

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Dresden, Germany

Stefan Geyer