Micron Technology Incorporated

Other

Stmicroelectronics S.r.l.

Stefan Frederik Schippers

Daniele Vimercati

Corrado Villa

Andrea Martinelli

Graziano Mirichigni

Xinwei Guo

Efrem Bolandrina

Ferdinando Bedeschi

Emanuele Confalonieri

Christophe Laurent

Stefano Ratti

Massimiliano Mollichelli

Gary G Lazarowics

Stefano Claudio Roseghini

Angelo Clemente Scardilla

Lorenzo Fratin

Paolo Fantini

Christophe Vincent Antoine Laurent

Marco Onorato

Sara Fiorina

Yuri Zambelli

The present disclosure provides a memory apparatus and a method for accessing a 3D vertical memory array. The 3D vertical memory array comprises word lines organized in planes separated from each other by insulating material, bit lines perpendicular to the word line planes, memory cells coupled between a respective word line and a respective bit line. The apparatus also comprises a controller configured to select multiple word lines, select multiple bit lines, and simultaneously access multiple memory cells, with each memory cell at a crossing of a selected word line and a selected bit line. The method comprises selecting a multiple word lines, selecting multiple bit lines and simultaneously accessing multiple memory cells, with each memory cell at a crossing of a selected word line of the selected multiple word lines and a selected bit line of the selected multiple bit lines. A method of manufacturing a 3D vertical memory array is also described.

Accessing memory cells in a vertical memory array

Methods, systems, and devices for a memory device with multiplexed digit lines are described. In some cases, a memory cell of the memory device may include a storage component and a selection component that includes two transistors. A first transistor may be coupled with a word line and a second transistor may be coupled with a select line to selectively couple the memory cell with a digit line. The selection component, in conjunction with a digit line multiplexing component, may support a sense component common to a set of digit lines. In some cases, the digit line of the set may be coupled with the sense component during a read operation, while the remaining digit lines of the set are isolated from the sense component.

Memory array with multiplexed digit lines

The present disclosure provides a memory device and accessing/de-selecting methods thereof. The memory device comprises a memory layer including a vertical three-dimensional (3D) memory array of memory cells formed therein, wherein a memory cell is accessed through a word line and a digit line orthogonal to each other, and the digit line is in a form of conductive pillar extending vertically; a pillar selection layer formed under the memory layer and having thin film transistors (TFTs) formed therein for accessing memory cells; and a peripheral circuit layer formed under the pillar selection layer and having a sense amplifier and a decoding circuitry for word lines and bit lines, wherein a TFT is configured for each pillar.

Vertical 3D memory device and accessing method

Methods, systems, and devices for power domain switches for switching power reduction are described. A device, such as a memory device, may receive an indication (e.g., a command) for a power domain component of the device to transition between states. The device may float first and second gate drivers. A pass gate may be used to connect (e.g., short) the first switch to the second switch. The pass gate may be deactivated to isolate the gates. The first and second gate drivers may be enabled, and the first and second gate drivers drive the first and second switches to disconnect the power domain component from a power source to deactivate the power domain component, or connect to the power source to activate the power domain component. The energy to switch between active and inactive states may thereby be reduced.

Power domain switches for switching power reduction

Methods, systems, and devices for differential amplifier schemes for sensing memory cells are described. In one example, a memory apparatus may include a differential amplifier having a first input node configured to be coupled with a memory cell and having an output node configured to be coupled with a sense component. In some examples, the memory apparatus may also include a capacitor having a first node coupled with the first input node, and a first switching component configured to selectively couple a second node of the capacitor with the output node. The differential amplifier may configured such that a current at the output node is proportional to a difference between a voltage at the first input node of the differential amplifier and a voltage at the second input node of the differential amplifier.

Differential amplifier schemes for sensing memory cells

Apparatuses, methods, and devices that can be utilized to provide temperature-based memory operations are described. One or more apparatuses can include a memory device and a controller coupled to the memory device and configured to: determine an operating temperature of the apparatus, determine one of a plurality of designated open blocks of the memory device to write data based on the operating temperature of the apparatus and a size of the data, and write the data in the determined one of the plurality of designated blocks of the memory device.

Temperature-based memory operations

Apparatuses and methods for calibrating sense amplifiers in a semiconductor memory are disclosed. An example apparatus includes an amplifier circuit and a calibration circuit. The amplifier circuit is configured to be coupled to a supply voltage and a reference voltage, and when activated the amplifier circuit is configured to provide an output signal at an output that is complementary to an input signal provided to an input. When activated by a calibration signal, the calibration circuit is configured to provide a calibration voltage to the output of the amplifier circuit, wherein the calibration voltage is an equilibration voltage between the supply voltage and the reference voltage provided to the amplifier circuit.

Apparatuses and methods for calibrating sense amplifiers in a semiconductor memory

Example embodiments described herein may comprise a transfer of firmware execution within a non-volatile memory device to one or more replacement instructions at least in part in response to a match between a code fetch address and an address stored in a trap address register.

Code patching for non-volatile memory

A method for accessing a non volatile memory device including at least one group or sector of memory cells divided into regions programmable with two different data storage densities and accessible with at least two reading modes, for example a two-level mode and a multilevel mode. The memory regions are being organized into pages including a sub-group of memory cells for storing error correction codes of the data stored in the multilevel mode. The method includes providing at the beginning of each page at least one first cell wherein the information concerning the ECC protection or not of the whole page is to be stored. In the sub-group of cells at least one second cell intended for the storage of information concerning the programmed or erased state of the same page is provided. The content of the first and of the second cell is read before accessing, in programming, the corresponding page of the memory region.

Growing community of inventors

Peschiera del Garda, Italy

Stefan Frederik Schippers