Globalfoundries Inc.

Stefan Flachowksy

Jan Hoentschel

Juergen Faul

Integrated circuits and methods of fabricating integrated circuits are provided. In an exemplary embodiment, an integrated circuit includes a bulk silicon substrate that is lightly-doped with a first dopant type divided into a first device region and a second device region, and a well region that is lightly-doped with a second dopant type formed in the second device region. The integrate circuit further includes heavily-doped source/drain extension regions of the first dopant type aligned to a first gate electrode structure and heavily-doped source/drain extension regions of the second dopant type aligned to a second gate electrode structure, and an intermediately-doped halo region of the second dopant type formed underneath the first gate electrode structure and an intermediately-doped halo regions of the first dopant type underneath the second gate electrode structure. Still further, the integrated circuit includes heavily-doped source/drain regions.

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Dresden, Germany

Stefan Flachowksy