Globalfoundries U.S. Inc.

Globalfoundries Inc.

Globalfoundries Dresden Module One Limited Liability Company & Co. Kg.

Globalfoundries Dresden Module One Limited Liability Company & Kg

Stefan Dünkel

Ralf Richter

Sven Beyer

Halid Mulaosmanovic

Dominik M Kleimaier

Johannes Müller

Thomas Melde

Martin Trentzsch

Robert Binder

Zhixing Zhao

Lars Müller-Meskamp

Joachim Metzger

An IC structure includes an MFMIS memory cell on a semiconductor substrate, and a CMOS transistor adjacent the MFMIS memory cell on the same semiconductor substrate. A method provides co-integration of the MFMIS memory cell with the CMOS transistor. The method may optionally co-integrate an MFIS memory cell. The IC structure and method provide a lower cost approach to forming MFMIS memory cells, which provide a number of advantages over MFIS memory cells.

IC structure with MFMIS memory cell and CMOS transistor

Structures including a ferroelectric field-effect transistor and methods of forming a structure including a ferroelectric field-effect transistor. The structure comprises a semiconductor substrate, a semiconductor layer, a dielectric layer arranged between the semiconductor layer and the semiconductor substrate, and first and second wells in the semiconductor substrate. The first well has a first conductivity type, and the second well has a second conductivity type opposite to the first conductivity type. A ferroelectric field-effect transistor comprises a gate structure on the semiconductor layer over the first well and the second well. The gate structure includes a ferroelectric layer comprising a ferroelectric material.

Ferroelectric field-effect transistors with a hybrid well

Structures for a ferroelectric field-effect transistor and methods of forming a structure for a ferroelectric field-effect transistor. The structure comprises a gate stack having a ferroelectric layer, a first conductor layer, and a second conductor layer positioned in a vertical direction between the first conductor layer and the ferroelectric layer. The first conductor layer comprises a first material, the second conductor layer comprises a second material different from the first material, and the second conductor layer is in direct contact with the ferroelectric layer.

Structures for a ferroelectric field-effect transistor and related methods

A nonvolatile memory device is provided, the device comprising a ferroelectric memory capacitor arranged over a first active region contact of a first transistor and a gate contact of a second transistor, whereby the ferroelectric memory capacitor at least partially overlaps a gate of the first transistor.

Ferroelectric nonvolatile memory device and integration schemes

Disclosed is a reconfigurable complementary metal oxide semiconductor (CMOS) device with multiple operating modes (e.g., frequency multiplication mode, etc.). The device includes an N-type field effect transistor (NFET) and a P-type field effect transistor (PFET), which are threshold voltage-programmable, which are connected in parallel, and which have electrically connected gates. The threshold voltages of the NFET and PFET can be concurrently programmed and the operating mode of the device can be set depending upon the specific combination of threshold voltages achieved in the NFET and PFET. Optionally, the threshold voltages of the NFET and PFET can be concurrently reprogrammed to switch the operating mode. Such a device is relatively small and achieves frequency multiplication and other functions with minimal power consumption. Also disclosed are methods for forming the device and for reconfiguring the device (i.e., for concurrently programming the NFET and PFET to set or switch operating modes).

Reconfigurable complementary metal oxide semiconductor device and method

A non-volatile memory (NVM) structure includes a first memory device including: a first inter-poly dielectric defined by an isolation layer over a first semiconductor layer over an insulator layer (SOI) stack over a bulk semiconductor substrate, a first tunneling insulator defined by the insulator layer, a first floating gate defined by the semiconductor layer of the SOI stack, and a first channel region defined in the bulk semiconductor substrate between a source region and a drain region. The memory device may also include a control gate over the SOI stack, an erase gate over a source region in the bulk substrate, and a bitline contact coupled to a drain region in the bulk substrate. The NVM structure may also include another memory device similar to the first memory device and sharing the source region.

Non-volatile memory structure using semiconductor layer as floating gate and bulk semiconductor substrate as channel region

The present disclosure relates to semiconductor structures and, more particularly, to rounded shaped transistors and methods of manufacture. The structure includes a gate structure composed of a metal electrode and a rounded ferroelectric material which overlaps an active area in a width direction into an isolation region.

Rounded shaped transistors for memory devices

Methods of forming a buffer layer to imprint ferroelectric phase in a ferroelectric layer and the resulting devices are provided. Embodiments include forming a substrate; forming a buffer layer over the substrate; forming a ferroelectric layer over the buffer layer; forming a channel layer over the ferroelectric layer; forming a gate oxide layer over a portion of the channel layer; and forming a gate over the gate oxide layer.

Growing community of inventors

Dresden, Germany

Stefan Dünkel