Rogers Germany Gmbh

Gfe Metalle Und Materialien Gmbh

Stefan Britting

Andreas Meyer

Karsten Schmidt

Xinhe Tang

Tilo Welker

Vitalij Gil

László Müller

Johannes Wiesend

Rainer Herrmann

Karl-Uwe Van Osten

Andrea Adler

Nico Kuhn

Dieter Knöchel

Manfred Götz

David Bierwagen

Maximilian Engel

Martin Reger

László MÜLLER

A solder material () for bonding a metal layer () to a ceramic layer (), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising:

Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer

A support substrate (), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer () and—an insulating element (), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer () and the insulating element () extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (), a binding layer () is formed between the at least one metal layer () and the insulating element (), and an adhesive layer () of the binding layer () has a surface resistance which is greater than 5 Ohm/sq.

Support substrate and method for producing a support substrate

A method for manufacturing a metal-ceramic substrate () includes

Method for producing a metal-ceramic substrate, solder system, and metal-ceramic substrate produced using such a method

A method for producing a semi-finished metal product (), in particular a semi-finished copper product, for a metal-copper substrate, in particular for a copper-ceramic substrate, including:

Method for producing a semi-finished metal product, method for producing a metal-ceramic substrate, and metal-ceramic substrate

A system for cooling a metal-ceramic substrate () having a component side () and a cooling side () opposite the component side (), comprising

System for cooling a metal-ceramic substrate, a metal-ceramic substrate and method for manufacturing the system

Metal-ceramic substrate and method for producing a metal-ceramic substrate

The present invention proposes a carrier substrate () for electrical components (), the carrier substrate () having a component side () and a cooling side () which is opposite the component side () and has a cooling structure (), the carrier substrate () comprising a primary layer () which faces the component side () and is produced from ceramic for electrical insulation, and a secondary layer () which faces the cooling side () for stiffening the carrier substrate (), characterized in that a metallic intermediate layer () is arranged between the primary layer () and the secondary layer () for heat transfer from the component side () to the cooling side (), the metallic intermediate layer () being thicker than the primary layer () and/or the secondary layer ().

Carrier substrate with a thick metal interlayer and a cooling structure

A soldering material () for active soldering, in particular for active soldering of a metallization () to a carrier layer () comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.

Soldering material for active soldering and method for active soldering

A carrier substrate () that includes an insulation layer () and a metal layer (), wherein a flank profile (), in particular an etching flank profile, at least zonally borders the metal layer () in a primary direction (P) extending parallel to the main extension plane (HSE), wherein, viewed in the primary direction (P), the flank profile () extends from a first edge () on an upper side () of the metal layer (), which faces away from the insulation layer (), to a second edge () on a lower side () of the metal layer (), which faces the insulation layer (), characterized in that the flank profile (), viewed in the primary direction (P), has at least one local maximum () and at least one local minimum ().

Carrier substrate for electrical, more particularly electronic, components, and method for producing a carrier substrate

A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterized by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 &#x3bc;m; heating the base material and the additional layer on the first surface to at least partially melt the solder layer; and connecting the base material to the at least one additional layer.

Method for producing a composite material

The copper-indium-gallium (CuInGa) alloy is in particular to be used for the production of sputter targets, tubular cathodes and similar coating material sources. It has a phase corresponding to a Cu5Zn8 prototype phase in which the lattice sites of the zinc atoms (Zn) are occupied by gallium atoms (gallium-substituted Cu5Zn8 phase) and in which indium is simultaneously introduced into the elementary cell or phase, making up a proportion of up to 26 wt %.

Growing community of inventors

Schnaittach, Germany

Stefan Britting