Esec, Trading Sa

Besi Switzerland Ag

Unaxis International Trading Ltd

Esec Ag

Oerlikon Assembly Equipment Ag, Steinhausen

Stefan Behler

Reto Schubiger

Beat Zumbuehl

Patrick Blessing

Brian Pulis

Ruedi Grueter

Fabian Hurschler

Rolf Schuermann

A die-ejector () comprising a chamber () with a cover plate () having a passageway, a plurality of plates () arranged inside the chamber () and reciprocally movable between an initial position () and an operating position (), respectively, intended to interact with the carrier to support the removal of the dies from the carrier, and a drive member () for moving the plates () to be moved from the operating position towards the initial position. The die-ejector () further comprises a magnet () and a spring system, respectively, which interacts with anchor sections () of the plates () and exerts on the plates () an attraction force (F') or an impact force, respectively, directed towards the operating position, and a stop member () for stopping the movement of the plates () in the operating position, the plates abutting the stop member () in the operating position.

Die ejector

The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.

Method for detaching and removing a semiconductor chip from a foil

The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.

Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

In order to eliminate the inclination of a semiconductor chip picked by a gripper, the height of at least three points on the underneath of the semiconductor chip is determined in relation to a reference surface and from this the inclination is calculated. Determining the heights takes place in that the semiconductor chip is lowered until the semiconductor chip comes into contact with a needle.

Method for aligning the bondhead of a Die Bonder

A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.

Die bonder and/or wire bonder with a device for holding down a substrate

A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.

Growing community of inventors

Steinhausen, Switzerland

Stefan Behler