Infineon Technologies Ag

Stefan Barzen

Alfons Dehe

Marc Fueldner

Wolfgang Klein

Ulrich Krumbein

Martin Wurzer

Giordano Tosolini

Evangelos Angelopoulos

Carsten Ahrens

Andreas Wiesbauer

Hans-Joerg Timme

Wolfgang Friza

Matthias Friedrich Herrmann

Juergen Wagner

Konstantin Tkachuk

Christian Herzum

Stefan Geissler

Michael Kropfitsch

Christoph Glacer

Christian Jenkner

Andre Brockmeier

Alexander Frey

Gunar Lorenz

Roland Helm

Alfons Dehé

Stephan Pindl

Uwe Seidel

Arnaud Walther

Johann Strasser

Mohsin Nawaz

Marc Füldner

Matthias Reinwald

Stefan Geißler

Xu Cheng

Jun Cheng Ooi

Jürgen Wagner

In an embodiment, a method for forming a microfabricated structure includes depositing a first membrane on a substrate, depositing a first isolation layer on the first membrane, depositing a stator layer on the first isolation layer, forming a perforated stator from the stator layer, wherein the first isolation layer is disposed on a first surface of the perforated stator, depositing a second isolation layer on a second surface of the perforated stator and depositing a second membrane on the second isolation layer, including depositing a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first glass layer having a low etch rate, and a second glass layer having a high etch rate embedded in the first glass layer.

Membrane support for dual backplate transducers

A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

Dual membrane transducer

A thermal emitter includes a freestanding membrane supported by a substrate, wherein the freestanding membrane includes in a lateral extension a center section, a conductive intermediate section and a border section, wherein the conductive intermediate section laterally surrounds the center section and is electrically isolated from the center section, the conductive intermediate section including a conductive semiconductor material that is encapsulated in an insulating material, wherein the border section at least partially surrounds the intermediate section and is electrically isolated from the conductive intermediate section, and wherein a perforation is formed through the border section.

Thermal emitter with embedded heating element

A sensor includes a membrane electrode, a counter-electrode, and at least one spring. The sensor can include a structure; a membrane electrode, which is deformable as a consequence of pressure and which is in contact with the structure; a counter-electrode mechanically connected to the structure and separated from the membrane electrode by a gap; and at least one spring mechanically connected to the membrane electrode and the counter-electrode, so as to exert an elastic force between the membrane electrode and the counter-electrode.

Sensor with a membrane electrode, a counterelectrode, and at least one spring

A micro electrical mechanical systems (MEMS) device includes a flexible membrane disposed over a substrate, and a first backplate disposed over the flexible membrane. The first backplate includes a first plurality of bumps facing the flexible membrane. The MEMS device further includes a plurality of features disposed at the flexible membrane, where each of the plurality of features being associated with a corresponding one of the first plurality of bumps.

MEMS devices

For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.

Sound transducer structure and method for manufacturing a sound transducer structure

In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the counterelectrode structure.

MEMS component and production method for a MEMS component

According to an embodiment, a microspeaker includes an acoustic micropump structure configured to pump at a first frequency above an upper audible frequency limit. The acoustic micropump structure is further configured to generate an acoustic signal having a second frequency by adjusting the pumping. Adjusting the pumping includes adjusting a direction of pumping for the acoustic micropump structure according to the second frequency. Adjusting the direction of pumping includes changing a direction of flow of an elastic medium through the acoustic micropump structure from a first direction to a second direction. The second frequency is below the upper audible frequency limit.

System and method for a pumping speaker

A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.

MEMS device

An MEMS sound transducer comprises a first and a second backplate, as well as a diaphragm, which is arranged between the first and the second backplate and is held by an edge fastening between the first and the second backplate. The MEMS sound transducer comprises a clamping structure, which is configured to provide fixing for the diaphragm when an electrostatic force acting in an operating state is applied between the first and the second backplate and at a distance from the edge fastening, and to release the fixing in absence of the electrostatic force.

MEMS sound transducer, MEMS microphone and method for providing a MEMS sound transducer

Growing community of inventors

Munich, Germany

Stefan Barzen