Fci, Inc.

Amphenol Fci Asia Pte. Ltd.

Fci Americas Technology Inc.

Fci Asia Pte. Ltd.

Stefaan Sercu

Stephen B Smith

Timothy A Lemke

Timothy W Houtz

Jan De Geest

Clifford L Winings

Winnie Heyvaert

Danny L C Morlion

Jan DeGeest

Joseph B Shuey

Gregory S Hull

A connector () is provided having a plurality of leads generally arranged in columns extending substantially parallel each other in a column direction (C) and being adjacent each other in a row direction (R). At least one first column comprises at least one first pair of single leads (S) substantially parallel each other in a first pair direction (P) to form a first differential pair. In at least a portion of the connector the first pair direction extends at an acute angle (a) to the column direction. Further, an assembly, and a circuit board are provided.

High performance connector

A connector is provided having a plurality of leads generally arranged in columns extending substantially parallel each other in a column direction and being adjacent each other in a row direction. At least one first column includes at least one first pair of signal leads substantially parallel each other in a first pair direction to form a first differential pair. In at least a portion of the connector the first pair direction extends at an acute angle to the column direction. Further, an assembly, and a circuit board are provided.

Connector assembly with low pair cross talk

Disclosed are methodologies for defining matched-impedance footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component. The via arrangement may be also be altered to limit cross-talk among neighboring signal conductors. Thus, the via arrangement may be defined to balance the impedance, cross-talk, and routing density requirements of the system.

Matched-impedance connector footprints

Disclosed are methodologies for defining matched-impedance surface-mount technology footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component. The via arrangement may be also be altered to limit cross-talk among neighboring signal conductors. Thus, the via arrangement may be defined to balance the impedance, cross-talk, and routing density requirements of the system.

Matched-impedance surface-mount technology footprints

A preferred embodiment of a cable harness assembly includes a shielded cable comprising a first and a second conductor for conducting a pair of differential signals, and a generally planar board having a first and a second electrically-conductive trace formed thereon and having a first and a second major surface. The first trace is electrically coupled to the first conductor at a first location on the first major surface and extends along the first major surface to a second location on the first major surface. The second trace is electrically coupled to the second conductor at a third location on the first major surface and extends along the first and the second major surfaces to a fourth location on the second major surface.

Paddle-card termination for shielded cable

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Brasschaat, Belgium

Stefaan Sercu